Hardware

  • Product of the Week: Maxim Integrated's Health Sensor Platform 3.0 (MAXREFDES104#)

    Product of the Week: Maxim Integrated's Health Sensor Platform 3.0 (MAXREFDES104#)

    The MAXREFDES104#, better known as the Health Sensor Platform 3.0, is Maxim Integrated’s third-generation wearable reference design for applications ranging from personal fitness to patient monitors.

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  • Newark Expands Market-Leading Soldering Range with GT Series from Metcal Featuring Adjustable Temperature Control

    Newark Expands Market-Leading Soldering Range with GT Series from Metcal Featuring Adjustable Temperature Control

    Metcal's best-in-class range of hand soldering systems with adjustable temperature offer superior soldering conditions, improved end product and greater efficiency for light to heavy load applications

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  • Europe Is on Its Way To Quantum Leadership, IQM Raises €39 M in Series A Funding

    Europe Is on Its Way To Quantum Leadership, IQM Raises €39 M in Series A Funding

    IQM Quantum Computers (IQM) announced that it has raised €39 M in Series A funding, bringing the total amount of funding raised to date to €71 M.

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  • 2,088 Gbps/in2 – COM-HPC Connectors Increase Speed and Density

    2,088 Gbps/in2 – COM-HPC Connectors Increase Speed and Density

    So, how do COM-HPC connectors enable 2,088 Gpbs/in2? To answer that question, we have to understand the basic design features of COM-HPC connectors and how they contribute to that metric.

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  • COM-HPC Scales Heterogeneous Embedded Hardware into High-Performance Edge Computing

    COM-HPC Scales Heterogeneous Embedded Hardware into High-Performance Edge Computing

    High-speed interfaces and provisions that allow modules to host PCIe targets mean that COM-HPC can support compute architectures ranging from Arm to GPUs to FPGAs and more.

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  • Heterogeneous LEGaTO Hardware

    Heterogeneous LEGaTO Hardware

    If today’s most efficient supercomputer, the NVIDIA DGX SuperPOD, would be scaled in size to deliver 1 exaflop of performance, it would consume 38 megawatts of power.

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  • New ASIL-D Certificate Boost Safety and Security Credentials of Winbond’s W75F Secure Memory Element

    New ASIL-D Certificate Boost Safety and Security Credentials of Winbond’s W75F Secure Memory Element

    Winbond Electronics Corporation announced that its W75F Secure Flash memory device with Common Criteria EAL5+ certificate, has achieved the ISO26262 ASIL Grade D safety certification.

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  • e-peas Releases AEM10941 Power Management IC for battery-less Monitoring Hardware

    e-peas Releases AEM10941 Power Management IC for battery-less Monitoring Hardware

    e-peas announced its AEM10941 power management IC (PMIC) has been designed into battery-less monitoring hardware from Xeelas.

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  • Powerbox Announces 750V DC/DC Converter for Light-Rail and Industrial Applications

    Powerbox Announces 750V DC/DC Converter for Light-Rail and Industrial Applications

    The switching stage of the new PRBX ENR500D is based on a resonant topology, per the company, providing a high efficiency of 95% typical across the low to high load range.

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  • Accelerating the Design and Deployment of Autonomous Cars Worldwide

    Accelerating the Design and Deployment of Autonomous Cars Worldwide

    To meet market demands, designers of autonomous cars will need to rely heavily on off-the-shelf technology. There simply isn’t the time to for OEMs to design everything in-house.

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  • Toshiba Announces New Dual-Channel H-bridge Motor Driver IC with PWM Control

    Toshiba Announces New Dual-Channel H-bridge Motor Driver IC with PWM Control

    Designed to meet the modern requirements of mains-, 5V USB-, and battery-powered equipment

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  • Should I use Off the Shelf or Custom Hardware in my Electronic Product?

    Should I use Off the Shelf or Custom Hardware in my Electronic Product?

    There are a range of inexpensive single-board computers on the market that can be used for electronic product development.

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  • Maxim Integrated Releases MAXREFDES177 IO-Link Reference Design

    Maxim Integrated Releases MAXREFDES177 IO-Link Reference Design

    The new development kit highlights the flexibility of the MAX22515 IO-Link transceiver, all while configuring all modes of the MAX2200 software-configurable analog IO.

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  • Infineon Releases Connected Home Security Evaluation Kit with OPTIGA™ Trust M for Raspberry Pi

    Infineon Releases Connected Home Security Evaluation Kit with OPTIGA™ Trust M for Raspberry Pi

    Infineon Technologies released the Connected home security evaluation kit with OPTIGA™ Trust M for Raspberry Pi.

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  • TapNLink Wins NFC Forum 2020 Award for Innovation

    TapNLink Wins NFC Forum 2020 Award for Innovation

    TapNLink wins with secure, intuitive NFC 3-Stroke connection for mobiles that eases configuration of HVAC appliances and industrial equipment.

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  • Boardcon Released Allwinner H6 Platform for 4K HDR Set-Top Box

    Boardcon Released Allwinner H6 Platform for 4K HDR Set-Top Box

    Boardcon released Allwinner H6 Platform Targets the Development of 4K HDR Set-Top Box.

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  • Flex Logix Announces Availability and Roadmap of InferX X1 Boards and Software Tools

    Flex Logix Announces Availability and Roadmap of InferX X1 Boards and Software Tools

    InferX X1P1 PCIe board at $399-$499 brings datacenter class throughput to lower price point edge servers; InferX X1P4 in 2021 will increase throughput 4x

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  • iXsystems Expands TrueNAS Product Line with R-Series Systems and Scale-out HCI Software

    iXsystems Expands TrueNAS Product Line with R-Series Systems and Scale-out HCI Software

    The TrueNAS Open Storage portfolio expanded with the TrueNAS R-Series storage systems and the TrueNAS SCALE Open Source HyperConverged Infrastructure (HCI) software.

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  • Vecow Launched ECX-2400/2200 PEG 10th Gen Intel Xeon/Core Workstation-Grade AI Computing System

    Vecow Launched ECX-2400/2200 PEG 10th Gen Intel Xeon/Core Workstation-Grade AI Computing System

    The series provides workstation-grade computing capability and providing balance between reliability and power budget for applications of edge computing.

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  • STMicroelectronics and Sanken Announce Strategic Partnership to Develop Intelligent Power Modules for Industrial and Automotive Products

    STMicroelectronics and Sanken Announce Strategic Partnership to Develop Intelligent Power Modules for Industrial and Automotive Products

    The two companies are developing and will jointly market 650V/50A and 1200V/10A industrial modules.

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