"You develop the idea, we take care of everything else." This could well be BOPLA's motto for our all-round carefree package. On request, the Bünde specialists for electronics enclosures provide advice to their customers at the start of the development phase and then accompany them through all the steps involving procurement, manufacturing, assembly and integration up to the completed, functioning and ESD-suitable packed device. 

 

Today almost all industrial embedded solutions are fitted with HMIs with a graphic user interface, and many of them use touch operation. BOPLA specialises in implementing HMI projects, and integrates screens with an input function in its enclosures. In this way, and on request, for capacitive touch displays the company takes responsibility for the printing of the glass pane and the joining together of the pane and display by means of the optical bonding process. In the same way as the embedding in the enclosure and the stabilisation of the touch unit, this is carried out using special casting technology, which takes place in a clean room. 

 

What's more, BOPLA's services include the application-specific mechanical processing of the enclosures as well as the printing, laser marking, cable assembly and quality tests. In all of these, consistent quality management during order production ensures the constant high quality of the modules.

 

Come and visit BOPLA from February 25 to 27, 2020, at the 'embedded world' trade fair in Nuremberg in Hall 3 on Stand 3-155, and learn all about our wide range of products!