Embedded Executive: Dr. Phil Lessner, SVP/CTO, KEMET

November 11, 2020 Rich Nass
 

Higher voltages and higher frequencies are becoming commonplace in embedded designs. That in itself doesn’t necessarily cause an issue. But, when you add in that packages continue to shrink in size, you have the potential for detrimental heat and airflow issues. How do you deal with that? That’s where the discussion started with Dr. Phil Lessner, the Senior Vice President and Chief Technology Officer, at KEMET. He had lots of advice for system designers in this week’s Embedded Executives podcast.

About the Author

Rich Nass

Richard Nass is the Executive Vice-President of OpenSystems Media. His key responsibilities include setting the direction for all aspects of OpenSystems Media’s Embedded and IoT product portfolios, including web sites, e-newsletters, print and digital magazines, and various other digital and print activities. He was instrumental in developing the company's on-line educational portal, Embedded University. Previously, Nass was the Brand Director for UBM’s award-winning Design News property. Prior to that, he led the content team for UBM Canon’s Medical Devices Group, as well all custom properties and events in the U.S., Europe, and Asia. Nass has been in the engineering OEM industry for more than 25 years. In prior stints, he led the Content Team at EE Times, handling the Embedded and Custom groups and the TechOnline DesignLine network of design engineering web sites. Nass holds a BSEE degree from the New Jersey Institute of Technology.

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