ADLink 3U VPX board suits mil applications

By Rich Nass

Executive Vice President

Embedded Computing Design

March 22, 2017

ADLink 3U VPX board suits mil applications

This one actually occurred a month or so before Embedded World, but it wasn’t until the show that I actually got a chance to take a peek. So, I’m including the ADLink Technology 3U VPX3010 series...

This one actually occurred a month or so before Embedded World, but it wasn’t until the show that I actually got a chance to take a peek. So, I’m including the ADLink Technology 3U VPX3010 series in my Embedded World post-show coverage. The rugged processor blade is designed with a 12-core Intel Xeon Processor D-1500 SoC to enable the server-level performance.

Applications that are suited for this board include those in the military, such as radar, digital signal processing, unmanned aerial/ground vehicles, and electronic warfare. A VPX3010 quick start kit and GPGPU companion products, such as an optional discreet VPX GPGPU blade or XMC module with the 384 CUDA core NVIDIA GeForce GT 745M GPU, help to reduce development risk and enhance the capabilities of the blade.

The ADLINK VPX3010 Series is SWaP-optimized and provides an extended operating temperature range of -40°C to +85°C. The rugged processor blade includes DDR4-2133 soldered ECC SDRAM up to 16GB; 2x 10G-KR and up to 3x 1GbE; up to PCIe x16 Gen3 interface supporting non-transparent bridge; one XMC expansion slot with PCIe x8 Gen3 with Rear I/O to P2; USB 3.0 and SATA 6 Gb/s for high I/O throughput.

The VPX3010 Series is available as both convection and conduction-cooled with conformal coating to support the requirements of mission-critical applications in military and aerospace, and supports a multitude of VPX and VPX REDI VITA specifications, as well as VITA 65 OpenVPX Architecture Framework and MIL-STD-810G. A VPX-R3010 Rear Transition Module is available to access rear I/O signals, and a tBP-VPX3000 Test Backplane supporting three payload slots is available for users to validate VPX3010 functionality. Support is included for Windows 7, Windows Embedded 7, Linux, and various real-time operating systems.

Richard Nass’ key responsibilities include setting the direction for all aspects of OSM’s ECD portfolio, including digital, print, and live events. Previously, Nass was the Brand Director for Design News. Prior, he led the content team for UBM’s Medical Devices Group, and all custom properties and events. Nass has been in the engineering OEM industry for more than 30 years. In prior stints, he led the Content Team at EE Times, Embedded.com, and TechOnLine. Nass holds a BSEE degree from NJIT.

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