- Working with wide 5G Downlink and Uplink OFDM waveforms
- Configuring wideband test benches for extensive frequency coverage
- Common sources of error in 5G beamforming
- Reducing test times of Over-the-air TX and RX test procedures
- Alternative to RF chambers for high volume production for mmWave RFICs
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In this week’s Five Minutes With…podcast, I spoke to Lawrence Romine, a vice president of Altium, one of th...
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In this week’s Dev Kit Weekly, Perry Cohen reviews the NXP EdgeReady MCU-based Solution for Alexa Voice Service.
To introduce this RISC-V solution, Mirabilis Design is conducting a complementary RISC-V Webinar on May 27.
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In this edition of Dev Kit Weekly, Perry Cohen reviews the RX65N Cloud Kit from Renesas.
In this edition of Dev Kit Weekly, Embedded Computing Design associate editor, Perry Cohen, reviews the ST EVALKIT-ROBOT-1.
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Toradex announced the launch of its newest family of System on Modules (SoM), Verdin. The first modules of the line feature the NXP i.MX 8M Mini/Nano applications processors.
MixComm announced its first production device, the SUMMIT 2629. The start-up’s technology is based upon breakthroughs developed at Columbia University CoSMIC lab led by Dr. Harish Krishnaswamy.
Seco has released the COM Express T7 DEV KIT, a Cross Platform Development Kit compatible with both x86 and Arm COM Express Type 7 modules.
Get the background & strategies you need: This white paper discusses the five main tester design challenges and five common approaches to ECU production test.
HEITEC presented HeiSys, an embedded system platform, at the embedded world trade conference in Nuremberg, Germany, in February.
NXP is excited to bring you the NXP eXperience – an online and interactive destination for all our news, content and training as it was originally planned for the show.
MYIR introduced the MYC-C335X-GW CPU Module, a Linux-ready module powered by TI's AM335x ARM Cortex-A8 processor, featuring PowerVR SGX530 for 2D and 3D graphics acceleration.