Perry Cohen

Perry Cohen, associate editor for Embedded Computing Design, is responsible for web content editing and creation in addition to podcast production. He also assists with the publication’s social media efforts which include strategic posting, follower engagement, and social media analysis. Before joining the ECD editorial team, Perry has been published on both local and national news platforms including KTAR.com (Phoenix), ArizonaSports.com (Phoenix), AZFamily.com, Cronkite News, and MLB/MiLB among others. Perry received a BA in Journalism from the Walter Cronkite School of Journalism and Mass Communications at Arizona State university. He can be reached by email at perry.cohen@opensysmedia.com Follow Perry’s work and ECD content on his twitter account @pcohen21

  • Xilinx Releases Real-Time Server Appliances

    Xilinx Releases Real-Time Server Appliances

    Xilinx released two new real-time computing video appliances for easy-to-use, ultra-high-density video transcoding applications.

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  • Lattice Releases Radiant 2.1

    Lattice Releases Radiant 2.1

    Lattice Semiconductor announced the availability of the Lattice Radiant 2.1, a software design tool for FPGAs.

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  • Dev Kit Weekly: Maxim Integrated MAX32630 Feather Application Platform

    Dev Kit Weekly: Maxim Integrated MAX32630 Feather Application Platform

    This week Perry takes a look at the MAX32630 Feather Application Platform from Maxim Integrated.

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  • Marvin Test Solutions Releases New PXI Multi-Function Card

    Marvin Test Solutions Releases New PXI Multi-Function Card

    Marvin Test Solutions released the GX3788 High-Performance FPGA Multi-Function Instrument which combines A/D, D/A, and digital I/O functionality.

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  •  The Zephyr Project Marks Milestones for Security and Product-Ready Maturity

    The Zephyr Project Marks Milestones for Security and Product-Ready Maturity

    In a May 2020 report, NCC outlined the issues that were found and detailed how the Zephyr Project Security Committee was working to fix the issues.

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  • MediaTek Introduces Helio G35 & G25 Gaming Series Chipsets

    MediaTek Introduces Helio G35 & G25 Gaming Series Chipsets

    MediaTek released the Helio G25 and G35, the company’s newest chips in the smartphone gaming-focused G series.

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  • GLOBALFOUNDRIES to Acquire Additional Land in Malta, NY

    GLOBALFOUNDRIES to Acquire Additional Land in Malta, NY

    GLOBALFOUNDRIES (GF), announced its purchase option agreement for about 66 acres of land adjacent to its Fab 8 manufacturing plant in Malta, NY.

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  • Digi International Releases IX20 Industrial Router

    Digi International Releases IX20 Industrial Router

    Digi International released the Digi IX20, an industrial router that provides adaptable, right-sized connectivity in industrial infrastructure, location monitoring, and unattended retail applications.

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  • IAR Systems Expands Development Toolchain for RISC-V

    IAR Systems Expands Development Toolchain for RISC-V

    IAR Systems announced the expansion of its development tool chain, IAR Embedded Workbench, for RISC-V.

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  • 3D pSLC NAND Bridges the Gap to DDR5 for 5G Base Station Designers

    3D pSLC NAND Bridges the Gap to DDR5 for 5G Base Station Designers

    So is DDR5 the answer for today’s 5G base station developers? For now, the answer is “not yet.” One alternative appears to be advanced DDR4 technology, 3D pSLC NAND flash.

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  • Siemens Acquires UltraSoC Technologies

    Siemens Acquires UltraSoC Technologies

    Siemens announced it has acquired UltraSoC Technologies, a Cambridge, UK-based provider of instrumentation and analytics solutions.

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  • Premio Releases New CT-MCL01 MicroATX Industrial Motherboard

    Premio Releases New CT-MCL01 MicroATX Industrial Motherboard

    Premio released its CT-MCL01 MicroATX industrial motherboard for IoT processing. It supports the 9th Gen Intel® Core™ processors.

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  • The SOURIAU 8STA Series, a Benchmark for High-Performance Connectors in the World of Motorsport

    The SOURIAU 8STA Series, a Benchmark for High-Performance Connectors in the World of Motorsport

    The 8STA series is a range of connectors derived from aerospace standards, where high-density, lightweight and reliable solutions must be able to withstand high levels of shock and vibration.

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  • Septentrio Releases New GNSS Receiver

    Septentrio Releases New GNSS Receiver

    Septentrio announced the launch of its AsteRx-m2 Sx OEM board. This GNSS receiver is the company’s approach to high-accuracy positioning.

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  • LF Energy Launches Digital Substation Initiative to Modernize Power Grid Infrastructure

    LF Energy Launches Digital Substation Initiative to Modernize Power Grid Infrastructure

    LF Energy, a Linux Foundation coalition, launched its Digital Substation Automation Systems (DSAS) initiative for the enhancement of power grid modularity.

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  • ABI Predicts Embedded Hardware Security Shipments to Hit 5 Billion by 2024

    ABI Predicts Embedded Hardware Security Shipments to Hit 5 Billion by 2024

    ABI Research, a global tech market advisory firm, predicted by the year 2024, shipments of secure hardware that serves digital authentication and embedded security will reach 5.3 billion.

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  • TCG Releases iTPM 2.0 Library Specification Revision 1.59

    TCG Releases iTPM 2.0 Library Specification Revision 1.59

    The Trusted Computing group (TCG) released its TPM 2.0 Library specification Revision 1.59.

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  • Privacera Announces Latest Version of the Privacera Platform for Secure Data Sharing in Databricks

    Privacera Announces Latest Version of the Privacera Platform for Secure Data Sharing in Databricks

    Privacera released its newest version of the Privacera Platform, and enterprise data governance and security solution for machine learning and analytic workloads in the public cloud.

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  • Maxim Integrated Releases MAX32670 MCU

    Maxim Integrated Releases MAX32670 MCU

    Maxim Integrated released the MAX32670, a low-power Arm® Cortex®-M4 microcontroller with a floating-point unit.

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  • TDK Releases World’s Lowest-power PDM Microphone

    TDK Releases World’s Lowest-power PDM Microphone

    TDK Corporation released its InvenSense T3902 pulse density modulation (PDM) microphone for consumer devices. The company said in a press release that it is the world’s lowest power PDM.

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