 | | The F600 board level air velocity sensor for continuous monitoring of airflow in small locations |
| Low height maxiFLOW heat sinks are designed for cooling ICs and other hot components in narrow packaging and low airflow velocity conditions |
| Customer Liquid Cooled Chassis for VITA-48 (VPX REDI) Applications |
| Startech Global specializes in offering product engineering services and systems solutions for AdvancedTCA, MicroTCA, and AdvancedMC design anddevelopment |
| Cooling for up to 130 W/slot |
| An integrated fan controller and temperature monitoring board |
| Air blocker boards that are inserted into unused VMEbus board slots that provide air dams on the upper and lower edges, blocking the airflow into and out of the empty slot, thus preventing "chimney effects" and improving system airflow |
| An integrated fan controller and temperature monitoring board |
| Electronic packaging solution specialist |
| Largest capacity Point to Point Protocol over Ethernet (PPPoE) termination server |
| Designed for analysis of cooling efficiency of AdvancedTCA chassis |
| AlSiC (Aluminum Silicon Carbide) is a metal matrix composite that used for thermal management of microelectronic, optoelectronic and power electronic devices. |
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