 | | When considering integrated circuits for an implantable device, one must examine the entire system from the top level. Overall system-level requirements, such as functionality, performance, size, weight and power should be considered. This white paper describes the electronic features of implantable circuits and the integration of these features into silicon. |
| Linux-ready ARM9 Single Board Computer |
| This document describes using an industrial-grade FPGA[ ] as a coprocessor or system on a chip (SoC) to bring flexibility to industrial applications. Providing a single, highly integrated platform for multiple industrial products, FPGAs can substantially reduce development time and risk. |
| | Open, connected, and scalable hardware/software platforms should connect design and verification flows to offer higher performance and a more flexible modeling environment. | |
| | Safety-critical software and SoCs – for the next generation of medical devices, what’s the straight-and-narrow path? | |
| With today’s SoCs increasing in complexity, it’s no wonder the software needed to run on these devices is taking longer to create, adapt, and optimize for a given application on a given piece of hardware. No question practices and methodologies behind system design need to change. |
| This paper introduces the video encode acceleration capability of the Intel Atom Processor E6xx System-on-Chip. In this paper, necessary detail on hardware capability is presented along with information on the software stack including operating system, graphics drivers, middleware and applications required to demonstrate hardware accelerated video encode. |
| | Embedded SoC designers must look for innovative solutions to reduce die size while remaining on mainstream process technologies. | |
| Reviewed key steps needed to implement automated assembly methods and also, the costs and benefits associated with these tasks and discussed how they are working today for real designs. |
| High-volume, optimized silicon forms the heart of all the latest 4G and LTE equipment designs including cell phones, data cards, and other high-end mobile wireless products. Making 4G work is a tough design problem. This white paper shows you how to recognize and avoid the pitfalls associated with lTE baseband development. |
| There is a high demand for a flexible, high-performance, low-power audio DSPs that add sound to an SOC’s design with the least amount of design effort and a small on-chip footprint. Tensilica’s HiFi Audio DSP[ ] family was carefully crafted to meet these requirements for the broadest possible range of consumer products. |
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