This announcement exemplifies how NI’s modular, software-defined wireless test platform continually expands to address the latest cellular and wireless connectivity standards including 802.11ac.

The modules’ simplified interconnectivity and industry-standard PXI-based architecture help increase system design efficiency and overall system performance in a variety of high-channel-count data acquisition and high-speed automated test applications including RF and semiconductor test.

Low Power, 16-bit Accurate Delta-Sigma DAC Allows Single Isolator Data Transmission

Seven New 24-bit and 16-bit Pin-Compatible ICs Accelerate Sensor Interface Design

The 2012 Audi new car models will be the first following National Semiconductor Corp.’s (NYSE:NSM) arrangement with Audi AG to provide analog[] integrated circuits (ICs) and subsystems for Modular Infotainment Device technology for Audi’s next-generation vehicles

Highly-integrated Half-bridge Gate Driver Boosts Power Density and Efficiency in High-voltage Applications

Analog[] Front End ICs and Multi-band Dynamic Filtering Firmware Compliant to National Electrical Code

Highly-integrated Driver Utilizes Unique Control Method to Equalize Current Between Multiple LED Strings

12 New Modules Comply with CISPR 22 (Class B) Standard, Current Sharing Enables 60A of Output

New Jitter Cleaners Enhance System Performance, Reduce Clocking BOM Cost

New Tool Accelerates Design of Multiple Load Power Supplies for Atmel and Freescale ARM Processors

Renewable Energy Grade ICs Reduce Photovoltaic System Cost, Improve Reliability and Simplify Design