 | | High Performance, Rugged, Extended Temperature, Fanless Embedded system with 5 GbE, Isolated DIO, SUMIT A,B, and Intel QM67 Express Chipset and choice of 2nd Generation Intel Core i3 / Core i5 / Core i7 mobile processor |
| High Performance, Rugged, Extended Temperature, Fanless Embedded system with 2 Front Panel Accessible HDD/SSD with key lock and Intel QM67 Express Chipset and choice of 2nd Generation Intel Core i3 / Core i5 / Core i7 mobile processor |
| High Performance, Rugged, Extended Temperature, Fanless Embedded system with 2 Front Panel Accessible HDD/SSD with key lock and Intel QM67 Express Chipset and choice of 2nd Generation Intel Core i3 / Core i5 / Core i7 mobile processor |
| This release updates all key software components in the embedded tool suite and adds support for devices based on the Yocto Project*. |
| OpenSystems Media (OSM), LLC today announced its upcoming E-cast on Speeding Machine-to-Machine (M2M) Solutions to Markets, moderated by Kenton Williston, Editor, Embedded Innovator magazine. M2M communications is transforming transportation, retail, medical, energy management, and other applications by connecting embedded devices to the Internet. The challenge for OEMs is dealing with the complex mix of M2M technologies, which include embedded hardware and software, enterprise services, and cloud computing. The challenges of M2M design can be simplified through standards-based solutions from the Intel(r) Embedded Alliance. |
| According to Mobile Future, the connected car is the third-fastest growing technological device, following smartphones and tablets. With the car becoming an extension of today’s digital lifestyle, Intel and Toyota are working together to adapt features that drivers and passengers use in the latest consumer electronic devices to an automotive environment. |
| NanoCOM-TCW2 is based on the new nanoETXexpress specification 2.0 which is the enhancement of the new pin-out. It is the ideal basis to implement the latest processor platforms such as the Intel® AtomâÑ¢ E6xx processors. AAEON introduces the launch of COM ExpressâÑ¢ ultra* NanoCOM-TC with Type 10 Pin-out, which enables dual screen operation for graphics intensive applications. NanoCOM-TC takes a standard AtomâÑ¢ processor coreâÑ¢ E6xxT, complete with display controller, GPU, memory controller and audio, and allows customers to link to it directly via a standard PCI Express interface. According to Intel®, the GPU packs 50% more graphics performance than existing chipsets. NanoCOM-TCW2 is rated -40 to +85 operation temperature which makes it a perfect product for Military and extreme environment applications. |
| 6U OpenVPX Blade Server, with a dual socket Intel® Xeon® processor and QuickPath Interconnect (QPI), delivers superior performance-per-watt and low latency, while operating in a standards based environment. |
| Mini-ITX Embedded Motherboard that adopts the Intel® AtomTM N450/D510 processor. This is the first Mini-ITX form factor that will utilize the dual-core Intel® AtomTM processor designed to enhance performance and versatility in many applications. The EMB-LN9T equips the most expandable interfaces and functions for diverse applications. |
| Intel® CoreâÑ¢ i3 / i5 / i7 Small Form Factor Solution. Filtered chassis for harsh environments. Measures 9.1"W x 11.8"D x 5.2"H and has brackets for wall mounting. |
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