Searching over 20,000 products; Stand by...
ARTICLES & TOPICS PRODUCT SEARCH WHITE PAPERS NEWSWIRE PREFERRED VENDORS E-CAST SCHEDULE THE MAGAZINE >
JEDEC  
Other topics:   RTOS, Multicore, VPX, AdvancedTCA, Microcontroller, FPGAs, Analog-to-Digital
YOUR QUERY:
1 through 31 of 31 products found
Products Vendors Photos 
PF2000from Derivation Systems, Inc.
A PC/104-based flexible reconfigurable I/O controller PC/104-compliant stackable modules User con...
  • PC/104-compliant stackable modules
  • Up to three FPGAs in 84-pin PLCC sockets
  • Up to 256 Kbytes of Flash/SRAM/EPROM

DuraStackfrom DPAC Technologies Corp.
A 1-Gbit CMOS SDRAM module Uses DPAC? laser weld technology to stack memory devices with a direct l...
  • Length and width of the stack is comparable to a TSOP type-II monolithic, while the height is less than the JEDEC MO-238 registered outline
  • JEDEC approved, two rank stack pinout and footprint
  • Optimized for low-profile RDIMMs and onboard applications

DDR3 memory VLP/ULPfrom Virtium Technology
DDR3 Very Low Profile (VLP) and DDR3 Ultra Low Profile (ULP) blade memory modules for embedded computing applica...
  • Virtium has expanded its DDR3 VLP memory modules offering by adding DDR3 ULP RDIMM, ULP UDIMM, and ULP Mini-RDIMM form factors to its current line of DDR3 VLP SODIMM, VLP SO-RDIMM, and VLP SO-CDIMM
  • ULP memory module series offers DIMM heights of 0.70", enhanced from the JEDEC standard of 0.72"
  • All Virtium VLP and ULP memory modules are available using monolithic DRAM with an extended temperature range

DDR2 Very Low Profile (VLP) and DDR2 Ultra Low Profile (ULP) blade memoryfrom Virtium Technology
DDR2 Very Low Profile (VLP) and DDR2 Ultra Low Profile (ULP) blade memory modules for blade server systems ¥...
  • Both types of memory modules are designed with significant enhancements to the JEDEC standard, including registered functionality, reduced module height, advanced cooling features, and densities up to 4 GB
  • VirtiumÕs VLP memory modules now include DDR2 VLP SODIMM, VLP SO-RDIMM and VLP SO-CDIMM
  • VirtiumÕs new ULP memory module series offers DIMM heights of 0.70 inches, enhanced from the JEDEC standard of 0.72 inches
  • All VirtiumÕs VLP and ULP memory modules are available in industrial temperature extended temperature range

DDR3 ULP RDIMMfrom Swissbit
High-speed/high-performance SDRAM memory module: the DDR3 Ultra Low Profile (ULP) Registered DIMM (RDIMM) ...
  • Ideal for compact server and small blade server applications
  • Fully compatible with JEDEC electrical specifications
  • Available in 4 GB and 2 GB densities at speeds of PC3-10600 1,333 Mb, PC3-8500 1,066 Mb, or PC3-6400 800 Mb

BVME065from BVM Ltd.
A 3U VMEbus memory module suitable for use with various types of JEDEC pinout RAM, ROM, and Flash devices rangin...
  • Three independent banks of 4 x 32-pin byte-wide device sockets for JEDEC compatible device pinouts
  • 12-Mbyte maximum capacity

TSVME 205Efrom TEKELEC Systems
A 6U memory board Two independent banks accepting 8 JEDEC devices Up to 4 Mbytes SRAM or EROM or F...
  • Two independent banks accepting 8 JEDEC devices
  • Up to 4 Mbytes SRAM or EROM or Flash EPROM per bank

VL493T5166B-D5from Virtium Technology
DDR2 ECC SODIMMs (SO-CDIMM and SO-RDIMM) Memory densities available up to 4 GB JEDEC standard pin-...
  • Memory densities available up to 4 GB
  • ECC support for embedded chipsets using x8 DRAM

DDR-SDRAM memoryfrom Trident Space and Defense
Dense high speed memory stacks for embedded applications Small JEDEC outline footprint Low inducta...
  • Small JEDEC outline footprint
  • Low inductance

INSSTE32882LV-GS01from Inphi Corporation
Low-voltage DDR3 device Production-ready, fully JEDEC compliant low-voltage DDR3 Register Supporting 1.35...
  • Production-ready, fully JEDEC compliant low-voltage DDR3 Register Supporting 1.35 V
  • JEDEC-compliant DDR3 Registered Clock Driver to support DDR3-1600 data rates at 1.35 V, ± 5%
  • Designed to help meet the critical challenge of reducing energy consumption by U.S.-based data centers

VLP DDR3 ECC SODIMMfrom Virtium Technology
Very Low Profile (VLP) DDR3 ECC SODIMM memory modules VLP DDR3 Registered ECC SODIMM, VLP DDR3 ECC SODIMM...
  • Virtium VLP DDR3 SODIMM ECC memory modules are designed with significant enhancements to the JEDEC standard, including ECC SODIMM error correction, registered ECC SODIMM functionality for the VLP SORDIMM and reduced module height of 0.72 inches, enhanced from the JEDEC standard of 1.18 inches
  • All Virtium DDR3 ECC SODIMM memory modules are available with optional SODIMM heat-spreader, industrial temperature, extended temperature range DRAM, or thermal sensors to improve thermal performance in demanding environments or for small compact chassis with limited internal space and minimal airflow

Series I MAPfrom SRC Computers
Powerful cost-effective reconfigurable processing Plugs directly into the DIMM slots of a commodity/COTS ...
  • Available in three models starting at $17,000

B2from MEN Micro Elektronik GmbH
A 3U 20 MHz MC68332 processor board 2-slot or 3-slot master/slave Digital and timer I/O (optically...
  • 512 Kbytes of SRAM

Intelligent CANbus Controllerfrom AcQ InduCom
4x CANbus interface 4x Motorola MC68376 microcontrollers @ 20 MHz 1 MB SRAM per microcontroller &#...
  • 4x Motorola MC68376 microcontrollers @ 20 MHz
  • RS232 (async.) available

PPChameleonfrom DAVE S.r.L.
CPU module PowerPC 405EP and provided with a SO-DIMM form factor Processor: AMCC PowerPC 405EP (13...
  • Physical 67,50 x 50,80 x 1,00 mm3

DIMM-01-0799from Meritec
DIMM sockets Socket housing accepts all JEDEC module outlines Stackable on .5-inch centers ...
  • Socket housing accepts all JEDEC module outlines
  • Stackable on .5-inch centers

TO-3 Socketsfrom Keystone Electronic Corp.
A line of low-profile, TO-3 power transistor sockets, designed to facilitate installation of JEDEC-TO-3 MPM powe...
  • ÊCollector strip terminal with 6-20 formed threads at either end of the socket for mounting ease

BGA Disk Drivefrom Trident Space and Defense
Fully functioning solid state disk drive built for embedded applications High performance High spe...
  • High performance
  • Can be configured for IDE, SATA, PATA, and SCSI applications

ARINC 429 Quad Receiverfrom Parvus Corporation
A PC/104 ARINC 429 receiver and carrier board Supports Full 32-Bit ARINC 429 Data Set ?our Op...
  • Ê34-pin Header Connection (Matching JEDEC EPROM Pinout Standard)
  • ÊPC/104-Compliant Carrier/daughterboard

CU-060/040from Dynatem, Inc.
A low-power, 3.3v, 3U processor board Available with CU-060 using the MC68060 and the CU-040 using the MC...
  • 16-bit timer/counter

PCM-3840from EMAC, Inc.
A PC/104-based DiskOnChip 2000 module Three sockets, up to 144-Mbyte capacity per socket 32-pin DI...
  • Three sockets, up to 144-Mbyte capacity per socket
  • ECC/EDC for high data reliability

5000 Seriesfrom Murata Power Solutions
Surface-mount common mode chokes Provides line filtering for designers of power converters looking to red...
  • Operating temperature range is -40 ¼C to +85 ¼C

UDE Debug Enginefrom pls Programmierbare Logik & Systeme GmbH
Debugging support for C166, XC166, XC2000, TriCore, PowerPC, ARM, Cortex-M3, XScale via JTAG, DAP, ASC, CAN ...
  • Automation interface allows the control of the debug engine, automatic flash programming in production
  • FLASH/OTP programming support for internal, external EEPROMs (AMD, intel, JEDEC), GangProgrammer available

Sn63Pb37 Eutectic Solder Spheresfrom Interconnect Systems, Inc.
Utilizing an IPC/JEDEC J-STD MSL Classification process, ISI deballs and adds lead spheres ?never subjecti...
  • Spheres are reattached in a nitrogen environment and ISI performs 100 percent optical inspection and then certifies the parts to original OEM specs for flatness and coplanarity

CPCI376from AcQ InduCom
A 3U CompactPCI, intelligent CANbus controller ?ased on the 20 MHz Motorola MC68376 microcontroller,...
  • ÊTimer module and RS-232 (async.) available

USB1T11ABQfrom Fairchild Semiconductor
A Universal Serial Bus transceiver in Micro Leadframe Packaging (MLP) MLP packaging occupies up to 84 per...
  • Component height of 1mm

V325-IADCfrom EKF-ELECTRONIK GmbH
A 6U, double size VMEbus analog-to-digital converter 68HC000/16MHz CPU MUX: HI508A/509A, input pro...
  • VMEbus: SADO24/SRMW16, Interrupt IH(1-7)

BVME771/772from BVM Ltd.
An intelligent low cost serial controller Four high speed serial channels Dual 85C30 or 85230 (772...
  • Up to 256-Kbyte EPROM space in two 32-pin JEDEC sockets
  • Real-time clock (772)

CPU86from Miriac
A VMEbus CPU with MPC8260 PowerQUICC II ?wo 10/100 Mbit Ethernet interfaces (one each via RJ45 conne...
  • ÊAn additional 16-bit wide SRAM area with battery backup is shareable with any other VMEbus master

Removable BGA Heatsinks: EZ Snap Seriesfrom Radian Heatsinks
Offered in round pin, plate fin, elliptical fin, and square pin designs Standard BGA heatsinks range from...

    DDR3 CRBfrom Inphi Corporation
    A DDR3 Clock Reference Board (CRB) designed specifically for high-performance RDIMM testing Perfo...
    • Enables major memory module and system designers to validate DDR3 RDIMMs and simulate system-level functionality, providing a comprehensive validation tool for DDR3 Register/PLLs

    Restart Search
    Or for the keyword JEDEC, see also: Vendors | Photos