Yole Report Identifies AI, HPC as Key Drivers of 2.5D, 3D TSV tech

February 7, 2019 Brandon Lewis

LYON, France. A report by Yole Development suggests that 2.5D and 3D Through-Silicon Via (TSV) technology is being driven by applications such as artificial intelligence and high-performance computing (HPC). The report, “2.5D / 3D TSV & Wafer Level Stacking: Technology & Market Updates,” highlights TSVs, 3D SoCs, and hybrid bonding packaging techniques used in hardware like 3D stacked memory, GPUs, FPGAs, and CMOS image sensors.

According to the report, “2.5D / 3D TSV & Wafer Level Stacking: Technology & Market Updates,” the stacking technologies market is expected to grow at a CAGR of 27 percent to more than $5.5 billion in 2023. HPC use of TSV and other stacking technologies is expected to double over this period, from 20 percent of total market share in 2018 to 40 percent at the end of the sample period. This represents roughly 6x growth from current market size.

The report also covers emerging TSV-less technologies, categorized as “with substrate” and “embedded in substrate” solutions. With-substrate technologies are currently used in Apple processors, while alternatives like the RDL11 interposer technology are scheduled to hit the market in 2020.

Companies covered in the report include Alchip, Alibaba, Amazon, AMD, Amkor, AMS, Apple, Audi, Avago, Baidu, Bosch, Bitmain, Broadcom, Cisco, DARPA, Facebook, Faraday, Foxconn and others.

A sample of the report can be viewed here: https://www.i-micronews.com/images/SAMPLES/PACKAGING/2.5D_3D_TSV_and_Wafer-Level_Stacking_Technology_and_Market_Sample.pdf.

 

About the Author

Brandon Lewis

Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at brandon.lewis@opensysmedia.com.

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