This week, the Insiders puzzle over Intel's recent decision to spin off Wind River to private equity firm TPG. Once viewed as a pivotal part of Intel's strategy to dominate the embedded and Internet of Things (IoT) technology markets, Wind River never fully integrated and will now benefit from "independence." Or will it? And, what does this mean for Intel's roadmap?
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#EMCC2018 - 4th Embedded Multi-Core Conference in Munich
Elektrobit, Infineon, iSYSTEM and Timing-Architects/Vector Informatik will host the 4th International Confe...
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Embedded World 2019 Best in Show Award Nominees: Development Tools
Embedded Computing Design's Best in Show Awards recognize innovative solutions for electronics engineers that will be showcased at Embedded World 2019. Here, we outline Development Tools.
Arm to Present Arm Leading Edge at embedded world
Arm has released Arm Leading Edge and will present it along with their partners at embedded world.
Connect Tech to Present two AI boards at Embedded World
Connect Tech Inc. will be presenting the COM Express Type 7 + GPU Embedded System and the Rogue Carrier for NVIDIA Jetson AGX Xavier at Embedded World 2019.
ADLINK To Present AI with Heterogeneous Computing at the Edge at Embedded World
ADLINK Technology is providing heterogeneous computing platforms optimized for AI at the Edge to swiftly turn data into action at the point of generation.
Allied Vision to Present new Camera Series at Embedded World; Nominated for Award
New camera series proposed for the Embedded Award in the Embedded Vision category at Embedded World.
RISC-V Foundation to Highlight New Growth; Hosts Scavenger Hunt at Embedded World 2019
The RISC-V Foundation booth will include live demonstrations from member companies Andes Technology, CloudBEAR, GreenWaves Technologies, Imperas Software, SiFive, Syntacore and UltraSoC.
OSS’ Bressner Will Appear at Embedded World 2019
One Stop Systems, Inc.’s subsidiary, Bressner Technology GmbH will be attending Embedded World Exhibition & Conference.
DiSTI Announces Partnership with Telechips
DiSTI and Telechips partnership highlights GL Studio UI technology running on the Dolphin+ Hardware.
Vecow Presenting GPU Computing Systems at Embedded World 2019
Vecow will be attending Embedded World 2019 presenting computing solutions built for machine vision, deep learning, and industrial AI applications.
Metrics Platform Provides Infinite Simulation Capacity; User Regression Reduced from Seven Hours to One Hour
Delivers Best Regression Performance, Superior Value over Traditional Systems
Redressing the Balance in Codec Technology for High Definition Voice Applications
The continued and widespread digitalization that is taking place throughout the industry vividly illustrates that we now represent the world in an increasingly binary way.
DVCon Panel to Explore How AI/Deep Learning will Reshape the Verification Landscape
Mentor's Jean-Marie Brunet Discussion to Lead Discussion with Executives from Achronix, AMD, Arm, Mythic, NVIDIA
Hardware Solutions Bringing AI to the Edge
Supermicro, a leading server and storage solution provider worldwide, recently launched an AIoT system designed to accelerate diverse Cloud workloads.
ISSCC 2019: eSilicon to present a paper and demonstrate 7nm 56G DSP SerDes operation over a five-meter cable assembly
"A Sub-250mW 1-to-56Gb/s Continuous-Range PAM-4 42.5dB IL ADC/DAC-Based Transceiver in 7nm FinFET" Will be Presented Monday, February 18, from 2:30-3 p.m.
The Features of Storage Products in Embedded and Industrial Applications
Embedded or industrial storage devices are highly customized products, and that’s because they need to fulfill a variety of industries, platforms and specifications.
Murata Software to Showcase Femtet at Embedded World 2019
Murata Software will be appearing at Embedded World to exhibit Femtet’s influence on the future of engineering.
Motor Drive Challenges in Service Robotics Design
A look into power MOSFET and package technologies for best performance of drives in service robotics applications.
Yole Report Identifies AI, HPC as Key Drivers of 2.5D, 3D TSV tech
According to “2.5D / 3D TSV & Wafer Level Stacking: Technology & Market Updates,” the stacking technologies market is expected to grow at a CAGR of 27 percent to more than $5.5 billion in 2023.
ETC: Embedded System Design Starts Here
Why should you be interested in the Embedded Technologies Conference? It goes to the heart of embedded computing.
MEDIA ALERT: ESD Alliance Invites DVCon Exhibitors and Attendees to Learn More about its Charter, Programs, Initiatives, Events