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Home » Processing » Embedded Insiders Podcast – CES 2018: Coughs, Cortanas, and Cars That Aren't Connected
Last week the Embedded Insiders faced the grind of CES 2018, but came away with a bunch of interesting topics to kick off 2018. Most notably, the Insiders encountered some problems with current use of the term, "connected car," listened in on some amazing advances in digital signal processing (DSP) for virtual assistants, and heard that LiDAR was a bunch of sh**.
Tune in and tag along as they explain.
Spectre and Meltdown: A new breed of vulnerability
The obvious way to eliminate Spectre/Meltdown vulnerabilities is eliminating the optimizations they exploit...
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MSC Technologies delivers industrial Mini-STX mainboard from Fujitsu with Intel Celeron processors "Gemini Lake"
MSC Technologies, the technology brand of Avnet Integrated Solutions, expands its range of Fujitsu Industrial Series mainboards with the D3544-S.
Spectrum's AWG controls physics experiments on single atoms at Stuttgart University
The Stuttgart University has chosen a Spectrum Arbitrary Waveform Generator for their experiments in which single atoms in a diamond are replaced by nitrogen atoms.
ESD Alliance to host evening featuring ARM's Simon Segars, Lucio Lanza of Lanza techVentures
Semiconductor Engineering's Ed Sperling will moderate a conversation on emerging trends of the digital world.
OneSpin announces immediate availability of OneSpin 360 EC-FPGA Tool Qualification Kit
Users can deploy EC-FPGA formal sequential equivalence checking into automotive ASIL D projects with no additional tool qualification requirements.
CommAgility LTE systems chosen by Lockheed Martin for satcom project
Integrated small cell PHY software and processing/RF hardware
RISC-V ecosystem shares ISA developments at embedded world 2018
To learn more about the activities of the RISC-V Foundation and its member companies at Embedded World, please visit: https://riscv.org/2018/01/risc-v-embeddedworld-2018/.
Acces I/O Products releases new family of USB analog I/O modules
Standard features in the USB-AIO Family include up to four 16-bit analog outputs and 16 high-current digital I/O lines—all packaged in a 4" x 4" x 1.25", rugged, industrial enclosure.
Embedded Computing Design Spring 2018 Embedded World issue
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Meltdown & Spectre: Diseases in need of immunization
To guard against hardware and software vulnerabilities that have yet to be detected, as well as attacks that have yet to be written, it is imperative to secure the entire chain of vulnerability.
2018 embedded processor report: Rise of the neural network accelerator
Different embedded processing solutions are used to execute neural network algorithms depending on the application, leaving a range of options for AI and ML developers to choose from.
dSPACE extends SCALEXIO product line
The DS6001 Processor Board combines high computation power and comprehensive real-time performance with the most compact design for processor hardware in the SCALEXIO product line.
TI releases MCU family for cost-sensitive power control applications
The highly integrated system-on-chip boosts performance in EV/HEV, grid infrastructure, and industrial applications.
Enclustra Mercury+ XU1 SoC module
The Xilinx Zynq UltraScale+ SoC module under any circumstances
LinkedHope releases two VPX image and video processing boards
January 30th, 2018, as an independent embedded computer manufacturer, LinkedHope launched two China local-designed, local-manufactured processing board.
Easily add touch functionality with best-in-class software libraries
Access several decades of touch expertise with Microchip’s best-in-class touch libraries for PIC, AVR, and SAM microcontrollers.
Renesas expands RX130 MCU lineup for touch-based appliances and industrial automation applications
New RX130 Group Extends Flash Memory to 512 KB and Package to 100-Pins, Enabling Highly Responsive Touch-Based Systems and Compatibility Across RX Devices
Cypress enables certified Bluetooth mesh products
Wireless MCU and Combo Solutions Deliver Connectivity Coverage for Smart Lighting and Appliances Throughout a Home
Netronix & Wuxi DSP jointly develop IoT-AI processor
New IoT-AI chip the size of a coffee bean redefines IoT space for a more efficient connected world.
HBM2 powers the next generation of high bandwidth applications