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  • DiSTI Announces Partnership with Telechips

    DiSTI and Telechips partnership highlights GL Studio UI technology running on the Dolphin+ Hardware.

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  • Vecow Presenting GPU Computing Systems at Embedded World 2019

    Vecow will be attending Embedded World 2019 presenting computing solutions built for machine vision, deep learning, and industrial AI applications.

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  • Metrics Platform Provides Infinite Simulation Capacity; User Regression Reduced from Seven Hours to One Hour

    Delivers Best Regression Performance, Superior Value over Traditional Systems

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  • Redressing the Balance in Codec Technology for High Definition Voice Applications

    The continued and widespread digitalization that is taking place throughout the industry vividly illustrates that we now represent the world in an increasingly binary way.

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  • DVCon Panel to Explore How AI/Deep Learning will Reshape the Verification Landscape

    Mentor's Jean-Marie Brunet Discussion to Lead Discussion with Executives from Achronix, AMD, Arm, Mythic, NVIDIA

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  • ISSCC 2019: eSilicon to present a paper and demonstrate 7nm 56G DSP SerDes operation over a five-meter cable assembly

    "A Sub-250mW 1-to-56Gb/s Continuous-Range PAM-4 42.5dB IL ADC/DAC-Based Transceiver in 7nm FinFET" Will be Presented Monday, February 18, from 2:30-3 p.m.

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  • The IoT, Defined

    By Gene Frantz
  • The Features of Storage Products in Embedded and Industrial Applications

    Embedded or industrial storage devices are highly customized products, and that’s because they need to fulfill a variety of industries, platforms and specifications.

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  • Murata Software to Showcase Femtet at Embedded World 2019

    Murata Software will be appearing at Embedded World to exhibit Femtet’s influence on the future of engineering.

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  • Motor Drive Challenges in Service Robotics Design

    A look into power MOSFET and package technologies for best performance of drives in service robotics applications.

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  • Yole Report Identifies AI, HPC as Key Drivers of 2.5D, 3D TSV tech

    Yole Report Identifies AI, HPC as Key Drivers of 2.5D, 3D TSV tech

    According to “2.5D / 3D TSV & Wafer Level Stacking: Technology & Market Updates,” the stacking technologies market is expected to grow at a CAGR of 27 percent to more than $5.5 billion in 2023.

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  • ETC: Embedded System Design Starts Here

    Why should you be interested in the Embedded Technologies Conference? It goes to the heart of embedded computing.

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  • MEDIA ALERT: ESD Alliance Invites DVCon Exhibitors and Attendees to Learn More about its Charter, Programs, Initiatives, Events

    Will have Latest Newsletter, Giveaways

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  • Thalia-DA unveils AMALIA analog schematic porting capability

    Thalia Design Automation today introduces advanced analog schematic porting capabilities within its AMALIA analog design automation tool suite.

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  • New CompactPCI Serial Carrier Card Hosts Two AcroPack Industrial I/O Modules for Data Acquisition, Control, or FPGA Processing

    New CompactPCI Serial Carrier Card Hosts Two AcroPack Industrial I/O Modules for Data Acquisition, Control, or FPGA Processing

    Acromag's new 3U CPCI-S.0 board interfaces two ruggedized mPCIe analog I/O, digital I/O, serial communication, and FPGA mezzanine modules to an embedded computing system.

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  • Cea-leti Builds Prototype Of Next-generation Mid-infrared Optical Sensors For Portable Devices

    Cea-leti Builds Prototype Of Next-generation Mid-infrared Optical Sensors For Portable Devices

    CEA-Leti today announced it has prototyped a next-generation optical chemical sensor using mid-infrared silicon photonics that can be integrated in smartphones and other portable devices

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  • ADACORE, NVIDIA Accelerate ISO 26262 Compliance by Securing Critical Firmware with Ada and SPARK

    NVIDIA will also migrate certain SoC product lines to the RISC-V instruction set. The hope is both moves will accelerate the ISO 26262 verification process.

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  • Software Simplicity: The Solution to Vision at the Edge

    The Intel Distribution of OpenVINO toolkit enables developers to streamline the deployment of deep learning inference and high-performance computer vision applications in use cases at the edge.

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  • Save energy and retrieve performance with RISC

    Save energy and retrieve performance with RISC

    Compact PICO-ITX board with RSIC CPU for KIOSK and POS applications combining low power consumption and high performance.

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  • EFCO Announces First Gaming Logic Box for AMD Quad Core Embedded G Series Processor

    EFCO Announces First Gaming Logic Box for AMD Quad Core Embedded G Series Processor

    The EGL6087 will be demonstrated at ICE London 2019, from February 5 - 7, in EFCO's booth #N1-309

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  • Avnet Awards Strella Biotechnology $100,000 as Winner of ASU Innovation Open

    Third annual competition recognizes forward-thinking IoT technologies by student engineers

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