ROHM and GaN Systems are collaborating in the gallium nitride (GaN) power semiconductor business, with the goal of contributing to the continuing evolution of power electronics. The companies have agreed to jointly develop form-, fit-, and function-compatible products using GaN semiconductor dies in both GaN Systems’ GaNPX packaging and ROHM’s traditional power semiconductor packaging. GaN Systems and ROHM will also work together on GaN semiconductor research and development activities to propose solutions for the industrial, automotive, and consumer electronics fields. And to contribute to greater energy savings and increased power densities in the power electronics market, both companies will continue to collaborate to expand their line-up of GaN products and broaden the range of choices.
- Dev Tools & OS
- Machine Learning
- Reference Designs
- System Block Diagrams
- Dev Kit Selector
- White Papers
- Webcasts & Events
- Product Search
- Embedded World
Marketer’s guide to Sensors Expo 2018
Your guide to increasing exposure, driving leads, booth traffic and outshining your competitors at Sensors ...
Most Recent Articles
Laird’s New Module Adds BL651 to Growing Nordic Family of BLE 5 Solutions
New BL651 module series is a cost-effective solution for simple BLE applications that speeds integration and enhances time to market.
Uptake Releases Next Generation, AI-Enabled APM Solution
Powered by Uptake’s purpose-built platform, Uptake APM accelerates digital transformation and delivers outcomes for industrial businesses.
Ampere’s Developer Program Expands Cloud Ecosystem and Accelerates Development Opportunities
Ampere introduced its new Lenovo developer platform and program to facilitate the open development of next-generation cloud applications. Ampere will be appearing at Arm TechCon Booth #1701.
Arm TechCon 2018 Names Avatar Integrated Systems Innovation Award Finalist for Design Team of the Year
Avatar Integrated Systems announced that its Aprisa and Apogee product design team was named a 2018 Arm TechCon Innovation Award finalist for design team of the year.
Telco Systems and Arm to appear at Arm TechCon 2018 presenting Optimized Edge Cloud Use Case with Arm-based uCPE
Telco Systems and Arm will present “Optimized Edge Cloud Use Case with Arm-based universal CPE (uCPE)” at Arm TechCon 2018.
Adesto will Display Latest in Custom ASIC and Memory Solutions at Arm TechCon
Adesto Technologies will demonstrate its innovative custom ASIC and non-volatile memory (NVM) solutions in booth #1020 at Arm TechCon.
Lynx to exhibit LynxSecure at Arm TechCon
Lynx Software Technologies to demonstrate its LynxSecure at Arm TechCon in booth 927.
QAD Releases Their Latest Version of QAD Cloud ERP and Related Solutions
QAD Inc. presents their newest QAD Cloud ERP and related solutions, including the general availability of the Channel Islands Initiative for use with QAD Cloud ERP 2018.
Irdeto Expands with New Connected Transport Office
Growth and momentum in Irdeto’s Connected Transport business drives an expanded presence in the Motor City.
FogHorn Releases Lightning Edge Intelligence 2.0 for Fast-scaling IIoT Deployments
Edgified machine learning, new automation and scalability tools, and powerful new user interface headline Lightning 2.0 as FogHorn extends its proven leadership in innovation for edge computing.
Peugeot Selects Qt for New Concept Car’s Digital Cockpit
Qt’s Development Framework Elevates PEUGEOT e-LEGEND CONCEPT Model’s Digital Cockpit to Next-Generation.
RZ/A2M Microprocessor by Renesas Electronics has Faster Processing of e-AI Imaging
Renesas’ RZ/A2M has exclusive DRP technology achieving real-time image processing at low power consumption.
Cypress Earns IATF 16949 Certification for Automotive Quality
Cypress Semiconductor attained the latest IATF16949:2016 and ISO9001:2015 certifications for automotive quality, imperative for fail-safe operation of automotive systems.
Ultra Electronics, 3eTI WiFiProtect Gains NIAP Common Criteria Certification
3eTI now offers the only wireless devices to be certified for NIAP’s Extended Package for Wireless LAN Access System protection profile.
Microchip’s New DSC Improves DSP Performance for Time-Sensitive Purposes
Microchip's new 16-bit Digital Signal Controllers System helps designers looking for digital signal processing power with the simplicity of a microcontroller.
Sensory Increases Wake Word Accuracy with New High-Res Voice Recognition and Authentication
Sensory raises the bar for always-listening wake word and speech recognition, with upgraded turn-key voice interface solutions for devices of all shapes, sizes and power requirements.
Lattice Enhances its Ultra-Low Power sensAI Stack
Lattice revealed improvements to its popular sensAI™ stack designed to accelerate time-to-market for developers of flexible machine learning inferencing in consumer and industrial IoT applications.
MagnaChip to Host 2nd Foundry Technology Symposium
MagnaChip to hold Foundry Technology Symposium at the Shangri-La in Shenzhen, China, on November 27, 2018 in an effort to increase MagnaChip’s brand awareness in the region.
MagnaChip to Offer Multi-Channel Mini LED Driver for Digital Signage
MagnaChip to offer a Multi-Channel Mini LED Driver for Digital Signage, it's a 36-Channel Output LED Driver Capable of 12 Bit Grayscale PWM Control.
Power Integrations Offers Voice-Controlled Smart Lights with RGBW LEDs