Arm Mbed extends partnerships with IBM Watson IoT, GlobalSign, Cybertrust to improve device management and security

April 24, 2018 Brandon Lewis

CAMBRIDGE, UK. Dipesh Patel, President of Arm’s IoT Services Group, revealed that the company’s Mbed platform is expanding technology partnerships with IBM Watson IoT, GlobalSign, and Cybertrust. The partnerships are intended to strengthen the connectivity, device management, provisioning, and security of building blocks for more than 300,000 Arm Mbed developers.

In an expanded arrangement with IBM, the Mbed Cloud will be integrated as part of the Watson IoT Platform running on the IBM Cloud. This will allow users to manage, provision, and update firmware over-the-air for their IoT devices through Mbed Cloud. The software bridge that enables this provides interoperability between several key applications hosted on the platforms, including:

  • Message Translation: Message formats between the Mbed Cloud and IBM Watson IoT Platform are automatically translated.
  • Device Representation: A device seen in Mbed Cloud can be displayed as an equivalent device in IBM’s Watson IoT Platform using a device “shadow”
  • Protocol Mapping: Mbed’s Message Queuing Telemetry Transport (MQTT) messaging backplane protocol can be integrated into the IBM Watson IoT Platform
  • Event Mapping: Device telemetry and event data can be transferred and conveyed between the platforms.

 

In addition, a new partnership with identity service providers GlobalSign and Cybertrust is designed to improve chip-to-cloud security for Mbed devices. An integration with both providers and the Mbed Cloud allows users to apply bring-your-own-certificate (BYOC) key management to IoT deployments using public key infrastructure (PKI) already in place.

Patel also announced plans for the open-source Mbed OS to support PSA-compliant trusted boot, storage, and opaque cryptography in the near future.

To find out more about the Mbed platform, visit www.mbed.com/en/platform/mbed-os/.

About the Author

Brandon Lewis

Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at brandon.lewis@opensysmedia.com.

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