ATP . The industry leading SIP (System-In-Package) process involves advanced wire bonding, stacking, and encapsulation stages which make ATP products more consistently durable and reliable.

ATP Industrial Grade SD Card and CF Card

SDA 1.1,2.0 specification speed performance rating: 150X (SD/SDHC)

CFA4.1 specification

rating: 300X (CF)

High storage capacity for high-resolution images data transfer such as GPS or mobile IPC system and many more.

Waterproof, dustproof, ElectroStatic Discharge (ESD) proof and extreme temperature resistant. They are built to withstand any environment your device can.

Wide temperature in -40 degree to 85 degree.

With the best SLC components in the industry, they last up to 10 times longer than other MLC-based products.