Taipei – August 15, 2018 – PCIe Gen3 is finally moving into the industrial and embedded market. With the demand for higher data transfer speeds, Innodisk is launching its M.2 NVMe PCIe Gen3×2 3ME2 MLC solid state drive (SSD); available in different heatsink-less form factors that all withstand temperatures ranging from ─40°C to 85°C, as well as speeds up to 3 times faster than the average SATA device.
The AIoT markets are characterized by a need for compactness to save space, data integrity and robustness to handle the various rough conditions of the device locations. Tight spaces can also create high temperatures and heat dissipation issues.
Innodisk’s newest M.2 module handles these issues in a brilliant manner. Compared to other modules of similar specifications, this new PCIe SSD 3ME2 brings out easier heat dissipation by lowering power consumption by 50%. The SSD comes in both 2280 and 2242 form factors, and through its industrial-oriented design, data integrity is easily handled through LDPC error correction and end-to-end data path protection (ETEP).
Furthermore, the SSD uses pure MLC flash with no SLC cache to avoid the inevitable speed drop as the cache fills up. Avoiding this problem altogether, the original MLC flash will continue to deliver stable and high speeds over the course of its lifetime.
The Vice President of Innodisk Cooperation, C. C. Wu, points out that Innodisk is taking the lead position in the market by providing this integrated solution. The new high-speed PCIe SSD 3ME2 is available in high-capacity selections; meanwhile, Innodisk’s cloud management platform, iCAP™, offers highly customizable functions and can be integrated into a huge number of multi-layered edge computing devices such as sensors, gateway, and hubs. Aiming at the future multi-level edge computing architecture, Innodisk provides the most complete intelligent IoT boost. For more product information, please see: https://www.innodisk.com/en/products/flash-stor[...]