Extended temperature SBCs powered by NXP i.MX 6Dual Cortex-A9 processor

July 20, 2018 IBASE Technology
 

IBASE Technology Inc., a world leader in the manufacture of industrial computer solutions, is pleased to announce two SBCs, both powered by an NXP i.MX 6Dual Cortex-A9 1.0GHz high performance processor. The IBR115 2.5-inch SBC and the IBR117 3.5-inch SBC are designed for use in applications in the automation, smart building, transportation, and medical markets.

“The embedded systems industry is currently undergoing a fast transformation that requires developers to build more robust, faster and less power consuming systems,” said Jackson Mao, VP of IBASE Product Planning Division. “Our IBR115 and IBR117, based on the i.MX 6Dual-Lite and i.MX 6Dual processor respectively, are built for this trend by supporting high performance processing, the lowest power consumption and compelling graphics.”

 

Rugged and compact design with high expansion capability

IBR115 and IBR117 are highly scalable SBCs with extended operating temperature support of -40°C to 85°C and an optional heatsink. Supporting 1GB DDR3 memory on board, the boards provide a number of interfaces for HDMI and single LVDS display interface, 4GB eMMC, Micro SD, COM, GPIO, USB, USB-OTG, Gigabit Ethernet and a M.2 Key-E interface. These embedded I/Os provide connection to peripherals such as WiFi, Bluetooth, GPS, storage, displays, and camera sensors for use in a variety of application environment while consuming levels of power far lower than industry expectations.

IBR115 and IBR117 come with Yocto 2.0 and Android 6.0 Board Support Package (BSP) to help customers reduce development time and designs costs, as well as accelerate time to market. The IBR117 has an additional single-channel LVDS (a total of two LVDS), two USB ports, one mini-PCIE with SIM socket, and two CAN Bus 2.0B headers.

 

Ibr115/ibr117 features:

 

-With NXP Cortex™-A9, i.MX 6Dual-Lite (IBR115) / i.MX 6Dual (IBR117) 1GHz processor

 

-Supports HDMI and Dual-channel LVDS interface

 

-Supports1GB DDR3, 4GB eMMC and Micro SD (IBR115) / SD (IBR117) socket for expansion

 

-Embedded I/O as COM, GPIO, USB, USB-OTG, audio and Ethernet

 

-M.2 Key-E (2230) and Mini PCI-E w/ SIM socket (IBR117) for wireless connectivity

 

-OpenGL ES 2.0 for 3D BitBlt for 2D and OpenVG 1.1

 

-Wide-range operating temperature from -40°C to 85°C

 

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