Renesas IO-Link Sensor Network Development Kit to Accelerate Industry 4.0

November 26, 2018 Brandon Lewis

TOKYO. Renesas Electronics has released the RZ/N1S IO-Link Master development kit for industrial sensor networks in smart factory environments. The RZ/N1S IO-Link development kit provides one CPU for managing the eight-port IO-Link Master device, a second CPU with an R-IN engine architecture that supports Industrial Ethernet communications, eight IO-Link connectors, and a sample protocol stack from TMG. The integrated package allows developers to immediately connect IO-Link slave devices for evaluation and prototyping.

The two CPUs present on the RZ/N1S IO-Link Master development kit are supported by 6 MB of on-chip SRAM that enables independent but simultaneous operation. Integrating the two CPUs in a 12mm x 12mm LFBGA package eliminates the need for external memory while optimizing the solution for space constrained industrial environments.

In addition, support for Industrial Ethernet enables communications with control-layer devices such as PLCs without the need for an external processor or memory.

For more information on the RZ/N1S IO-Link solution, visit www.renesas.com/us/en/products/software-tools/boards-and-kits/eval-demo/io-link-master-development-kit.html.

 

About the Author

Brandon Lewis

Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at brandon.lewis@opensysmedia.com.

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