Simplify EMI Compliance with Maxim Power Modules

July 16, 2018 Rich Nass

EMI is one of those dirty words (okay, it’s an acronym) in board and system design. Some designers just keep their fingers crossed and hope for the best, while others spend considerable time making sure that EMI effects don’t have a negative impact on their board or system,

One way to streamline this portion of the design process is to take advantage of Maxim’s Himalaya power modules. These solutions, which comply with CISPR 22 and EN 55022, are suited for a host of general-purpose applications, such as industrial, building and factory automation, communications, and consumer electronics.

The Himalaya power modules integrate most of the components needed for a power supply into one compact package. That includes a synchronous switching regulator IC, an inductor, resistors, and capacitors. The result is an efficient, fully integrated solution that complies with EMI requirements.

While modules may suit many needs, designers have the option to migrate, as needed, between modules and ICs to tradeoff cost, size, and ease of use. The high-efficiency, low-profile, wide input voltage, step-down DC-DC power modules are available in a system-in-package (SiP) or ultra-small micro system level IC (uSLIC). These ready-made, reliable, easy-to-use modules save PCB space and reduce design time for 5-, 12-, 24-, 36-, 48-, and 60-V rails. The devices that make up the family include the MAXM15462, MAXM17532, MAXM17574, MAXM17575, and MAXM17761.

About the Author

Rich Nass

Richard Nass is the Executive Vice-President of OpenSystems Media. His key responsibilities include setting the direction for all aspects of OpenSystems Media’s Embedded and IoT product portfolios, including web sites, e-newsletters, print and digital magazines, and various other digital and print activities. He was instrumental in developing the company's on-line educational portal, Embedded University. Previously, Nass was the Brand Director for UBM’s award-winning Design News property. Prior to that, he led the content team for UBM Canon’s Medical Devices Group, as well all custom properties and events in the U.S., Europe, and Asia. Nass has been in the engineering OEM industry for more than 25 years. In prior stints, he led the Content Team at EE Times, handling the Embedded and Custom groups and the TechOnline DesignLine network of design engineering web sites. Nass holds a BSEE degree from the New Jersey Institute of Technology.

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