Taipei, Taiwan, May 10, 2018 - VIA Technologies, Inc., today announced the launch of the VIA Edge AI Developer Kit, a highly-integrated package powered by the Qualcomm® Snapdragon™ 820E Embedded Platform that simplifies the design, testing, and deployment of intelligent Edge AI systems and devices.
The kit combines the VIA SOM-9X20 SOM Module and SOMDB2 Carrier Board with a 13MP camera module that is optimized for intelligent real-time video capture, processing, and edge analysis. Edge AI application development is enabled by an Android 8.0 BSP, which includes support for the Snapdragon Neural Processing Engine (NPE) and full acceleration of the Qualcomm® Hexagon™ DSP, Qualcomm® Adreno™ 530 GPU, or Qualcomm® Kryo™ CPU to power AI applications. A Linux BSP based on Yocto 2.0.3 is set to be released in June this year.
“The VIA AI Edge Developer Kit reduces the cost and complexity of designing, testing, and deploying next-generation Edge AI systems and devices,” said Richard Brown, Vice-President of International Marketing, VIA Technologies, Inc. “By bringing together the core hardware and software components into a single package, the kit is primed for the development and optimization of video AI applications such as facial recognition and object detection for a myriad of smart camera, smart signage, interactive kiosk, and intelligent robotics systems and devices.”
Availability and Pricing
The VIA Edge AI Developer Kit is available in two configurations from the VIA Embedded online store at:
VIA SOM-9X20 SOM Module and SOMDB2 Carrier Board with 13MP CMOS Camera Module (COB 1/3.06” 4224x3136 pixels): US$629 plus shipping
VIA SOM-9X20 SOM Module and SOMDB2 Carrier Board: US$569 plus shipping
Optional 10.1” MIPI LCD touch panel: US$179 plus shipping.
VIA also provides a full set of hardware and software customization services that accelerate system commercialization and minimize development costs. A full turnkey development service is also available.
The VIA SOM-9X20 is a highly-integrated system-on-module powered by the Qualcomm Snapdragon 820E embedded platform. Measuring just 8.2cm x 4.5cm, the module features 64GB eMMC Flash memory and 4GB LPDDR4 SDRAM onboard and offers rich I/O and display expansion options through its MXM 3.0 314-pin connector, including USB 3.0, USB 2.0, HDMI 2.0, SDIO, PCIe, MIPI CSI, MIPI DSI, and multi-function pins for UART, I2C, SPI, and GPIO.
For more information about the VIA SOM-9X20 please visit: https://www.viatech.com/en/boards/modules/som-9[...]
For images related to this release, please visit: https://www.viagallery.com/som-9x20/
About VIA Technologies, Inc.
VIA Technologies, Inc is a global leader in the development of highly-integrated embedded platform and system solutions for AI, IoT, computer vision, autonomous vehicle, healthcare, and smart city applications. Headquartered in Taipei, Taiwan, VIA’s global network links the high-tech centers of the US, Europe and Asia, and its customer base includes the many world’s leading hi-tech, telecommunications, consumer electronics industry brand names.