Pixus Technologies releases snap-on cover lids for electronics enclosures

January 30, 2018 ECD Staff

Pixus Technologies, a provider of embedded computing and enclosure solutions, now offers covers for instrumentation enclosures with snap-on lids for easy assembly.

The new Pixus enclosure lids feature a side edge fold with half shears that allow a solid or perforated enclosure cover to snap into place. The covers have side notches for fitting into rails with 160mm, 280mm or 280mm depths. This lid design provides easy and cost-effective assembly. EMC gaskets are also included. The snap-on lids are available for Pixus’ Vario, RiCase, Mobile, and EMC subrack enclosure systems.

Pixus provides subracks and electronics enclosures for various applications, including Industrial, Energy, Communications, Mil/Aero, Medical, Transportation, Research/Physics, and other markets. The company also provides backplanes, chassis platforms, and components for embedded computing systems.

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