It may not have been the sexiest announcement at the recent APEC show, but TT Electronics was showing a heatsink, the WMHP-HS, which is specifically designed to optimize the thermal performance of the company’s WMHP series power resistors. TT Electronics is known for producing components performance critical applications.
Providing a combination of high surface area, enhanced cooling performance, compact dimensions, and light weight, the PCB mounting heatsink is suited for use in power supplies, power amplifiers, motor drives, and in-rush current control applications requiring resistors operating in the 20- to 100-W range.
The WMHP-HS heatsink is aimed at designs using TO220 or TO247 power resistors in compact power electronic assemblies in the industrial and medical sectors. Factors driving the demand for this type of product are the growth in distributed power management and motion control in industrial and automated systems, and the pressure to reduce size and weight whilst increasing cooling effectiveness and product reliability.
Extruded from 6063-T5 aluminum, the WMHP-HS heatsink’s compact 42- by 25-mm footprint minimizes the necessary PCB area, and its low thermal resistance keeps assemblies cool and improves reliability. Reducing overall product weight and assembly time, the heatsink uses two solderable tinned brass pins instead of fixings to secure it. It has a black anodized finish and features an optimized profile with ridged fins for high surface area and low mass.
A TO-220 package resistor may be fitted to either side of the heatsink as the thermal performance is the same for both mounting surfaces. Furthermore, two packages may be fitted, one each side, provided the total power dissipated does not exceed the rating of either. A TO-247 package can be fitted to the wider of the two mounting surfaces.
About the Author
Richard Nass is the Executive Vice-President of OpenSystems Media. His key responsibilities include setting the direction for all aspects of OpenSystems Media’s Embedded and IoT product portfolios, including web sites, e-newsletters, print and digital magazines, and various other digital and print activities. He was instrumental in developing the company's on-line educational portal, Embedded University. Previously, Nass was the Brand Director for UBM’s award-winning Design News property. Prior to that, he led the content team for UBM Canon’s Medical Devices Group, as well all custom properties and events in the U.S., Europe, and Asia. Nass has been in the engineering OEM industry for more than 25 years. In prior stints, he led the Content Team at EE Times, handling the Embedded and Custom groups and the TechOnline DesignLine network of design engineering web sites. Nass holds a BSEE degree from the New Jersey Institute of Technology.Follow on Twitter More Content by Rich Nass