NEEDHAM, Mass.– The Cloud Standards Customer Council (CSCC) will be holding a Cloud in the Public Sector Summit on day one of its quarterly face-to-face meeting on March 19-20, 2012 at the Hyatt Regency Reston, in Reston, VA. For more information and to register, visit www.cloud-council.org/March2012/index.htm.

In this two-day cloud event, the CSCC will bring together international public sector Cloud leaders to exchange information about current projects, future plans, and prioritized requirements. Standards Development Groups and Cloud Providers will be present to discuss progress related to the prioritized requirements. Attendees will explore possible frameworks for ongoing discussion and coordination across international public sector Cloud initiatives, SDOs, and Cloud Providers.

The emphasis will be on the standardizations needed in technology, best practices, organizations, and policies for interoperability, portability, and trust of Clouds across national and regional boundaries. A key topic will be Priority Action Plans for international security, portability and interoperability standards as called for in NIST’s Cloud Technology Roadmap.

The day will include customer keynotes, updates from SDOs, talks on cloud provider offerings for the public sector from providers themselves. Program highlights for the Cloud in the Public Sector Summit include:

NIST will present “Cloud Technology Roadmap, FedRAMP Security Guidelines, Priority Requirements, and Action Plans”

David McClure, Associate Administrator of the Office of Citizen Services and Communications will present an update on GSA Cloud activities

Jean-François Junger, European Commission, Head of Sector, DG Information Society and Media will present “EC plan for the year 2012 in the area of Cloud Computing”

Global Public Sector Cloud Updates, with participants representing Europe, India, Canada, Singapore, the UK, and Korea

Cloud SDO Status and Plans Related to Public Sector Requirements, with participation from OASIS, DMTF, SNIA, OGF, IEEE, Global Intercloud Technical Forum, and the Cloud Security Alliance

Cloud Providers Offerings for Public Sector, featuring presentations from Amazon.com, Huawei, IBM, Salesforce and Microsoft

The Cloud in the Public Sector Summit transitions into the CSCC quarterly face-to-face meeting on Tuesday, where the morning session will focus on high priority international public sector Cloud requirements, gathering feedback to map requirements, making action plans and discussing future needs. The afternoon will feature a keynote on Cloud Security, a presentation on the status of the new SLA Cookbook project, and updates from the Working Groups.

Membership in the CSCC is free for qualified end-user organizations. The membership application is available at www.cloud-council.org/application. Vendors may join as sponsors. For membership or sponsorship questions, contact Ken Berk at ken.berk@omg.org or +1-781-444 0404.

About the Cloud Standards Customer Council

The Cloud Standards Customer Council (CSCC) is an OMG® end user advocacy group dedicated to accelerating cloud’s successful adoption, and drilling down into the standards, security and interoperability issues surrounding the transition to the cloud. The Council is not a standards organization, but will complement existing cloud standards efforts and establish a core set of client-driven requirements to ensure cloud users will have the same freedom of choice, flexibility, and openness they have with traditional IT environments. The Cloud Standards Customer Council is open to all end-user organizations. IBM, Kaavo, Rackspace and Software AG are Founding Sponsors. For more information on CSCC, visit www.cloud-council.org.

PHOENIX– ON Semiconductor Corporation (Nasdaq: ONNN):

For the fourth quarter of 2011, highlights include:

Total revenues of approximately $767.9 million

GAAP gross margin of 31.1 percent

Non-GAAP gross margin of 32.9 percent

GAAP net loss per fully diluted share of $0.02

Non-GAAP net income per fully diluted share of $0.13

Record cash, cash equivalents and short-term investments of $901.5 million

Completed a $325 million five-year senior revolving credit facility

Extended debt maturity of $198.6 million of 2.625% convertible senior subordinated notes from December 2013 to December 2016 via a notes exchange

For 2011, highlights include:

Record total revenues of approximately $3.442 billion, up approximately 49 percent compared to 2010

Record adjusted EBITDA of $626.7 million

ON Semiconductor Corporation (Nasdaq: ONNN) today announced that total revenues in the fourth quarter of 2011 were $767.9 million, a decrease of approximately 14 percent from the third quarter of 2011. During the fourth quarter of 2011, as previously indicated, the company was negatively impacted from the flood in Thailand. During the fourth quarter of 2011, the company reported a GAAP net loss of $8.8 million, or $0.02 per fully diluted share. The fourth quarter 2011 GAAP net loss was impacted by $67.2 million of special items which include restructuring, asset impairment and other charges, which were primarily related to the Thailand flood and charges associated with the convertible notes exchange. The complete special item details can be found in the attached schedules.

Fourth quarter 2011 non-GAAP net income was $58.4 million, or $0.13 per share on a fully diluted basis. Third quarter 2011 non-GAAP net income was $110.5 million, or $0.24 per share on a fully diluted basis. A reconciliation of these non-GAAP financial measures (and other non-GAAP measures used elsewhere in this release, such as non-GAAP gross margin and adjusted EBITDA) to the company’s most directly comparable measures prepared in accordance with U.S. GAAP are set forth in the attached schedules and on our website at www.onsemi.com/.

On a mix-adjusted basis, average selling prices for ON Semiconductor in the fourth quarter of 2011 were down approximately two to three percent when compared to the third quarter of 2011. Total company GAAP gross margin in the fourth quarter was 31.1 percent. Total company GAAP gross margin in the fourth quarter included a net charge of approximately $13.3 million, or approximately 180 basis points, from special items including the Thailand related inventory write down. Total company non-GAAP gross margin in the fourth quarter was 32.9 percent.

Adjusted EBITDA for the fourth quarter of 2011 was $122.0 million. Adjusted EBITDA for the third quarter of 2011 was $169.9 million.

Total revenues for 2011 were a record $3.442 billion, an increase of approximately 49 percent from $2.313 billion in 2010. During 2011, the company reported GAAP net income of $11.6 million, or $0.03 per fully diluted share. The 2011 GAAP net income included net charges of $383.5 million from special items. During 2010, the company reported GAAP net income of $290.5 million, or $0.65 per fully diluted share. The 2010 GAAP net income included net charges of $105.3 million from special items. The special item details can be found in the attached schedules.

The non-GAAP net income for 2011 was $395.1 million, or $0.86 per share on a fully diluted basis. The non-GAAP net income for 2010 was $395.8 million, or $0.89 per share on a fully diluted basis.

The company’s GAAP gross margin in 2011 was 29.3 percent. GAAP gross margin in 2011 included a net charge of approximately $190.8 million, or approximately 550 basis points, from special items. Non-GAAP gross margin in 2011 was 34.8 percent. The company’s GAAP gross margin in 2010 was 41.3 percent. GAAP gross margin in 2010 included a net charge of approximately $10.4 million, or approximately 50 basis points, from special items. Non-GAAP gross margin in 2010 was 41.8 percent. The special item details can be found in the attached schedules.

“2011 was a transformational year for the company,” said Keith Jackson, ON Semiconductor president and CEO. “During the year we completed the acquisitions of SANYO Semiconductor and the CMOS Image Sensor Business Unit. We achieved record annual revenues and adjusted EBITDA in 2011 and ended the year with our highest cash, cash equivalents and short-term investments in our history at over $900 million. After a challenging second half of 2011 for the industry and ON Semiconductor, we believe that the first quarter of 2012 represents the bottom of the current semiconductor cycle.”

First Quarter 2012 Outlook

“During the fourth quarter, the company faced significant challenges related to the flood in Thailand and the resulting damage to our SANYO Semiconductor manufacturing facilities located in that country,” Jackson said. “Our SANYO Semiconductor segment revenue in the first quarter of 2012 will continue to be negatively impacted by lower production capacity as a result of the Thailand flood. We are, however, expecting SANYO Semiconductor revenues to be approximately flat compared to the fourth quarter of 2011 as orders that were fulfilled out of finished goods inventory in the fourth quarter of 2011 will begin to be fulfilled from production capacity at other locations within our global internal and external manufacturing network in the first quarter of 2012. We also believe that the historical ON Semiconductor business will be seasonally down in the first quarter of 2012.”

“Based upon product booking trends, backlog levels and estimated turns levels, we anticipate that total ON Semiconductor revenues will be approximately $720 to $760 million in the first quarter of 2012,” Jackson said. “Backlog levels for the first quarter of 2012 represent approximately 80 to 85 percent of our anticipated first quarter 2012 revenues. We expect that average selling prices for the first quarter of 2012 will be down approximately two to three percent when compared to the fourth quarter of 2011. The non-GAAP outlook for the first quarter of 2012 includes stock-based compensation expense of approximately $8 to $10 million.”

The following table outlines ON Semiconductor’s projected first quarter of 2012 GAAP and non-GAAP outlook.

On Semiconductor Q1 2012 Business Outlook

Total ON Semiconductor Special Total ON Semiconductor

GAAP Items *** Non-GAAP****

Revenue $720 to $760 million $720 to $760 million

Gross Margin 31.5% to 32.5% 31.5% to 32.5%

Operating Expenses $195 to $200 million $15 million $180 to $185 million

Net Interest Expense / Other Expenses $12 million $12 million

Convertible Notes, Non-cash Interest Expense* $9 million $9 million $0 million

Tax $4 to $5 million $4 to $5 million

Fully Diluted Share Count ** 460 million 460 million

* Convertible Notes, Non-cash Interest Expense is pursuant to FASB’s Accounting Standards Codification (“ASC”) Topic 470: Debt.

** Fully diluted share count can vary for, among other things, the actual exercise of options or restricted stock units, the incremental dilutive shares from all of the company’s convertible senior subordinated notes, and the repurchase or the issuance of stock or convertible notes or the sale of treasury shares. Please refer to the table on our website for potential changes to the Fully Diluted Share Count. This table can be found on our website at www.onsemi.com under Investors – Investor Relations, Quarterly Results.

*** Special Items can include: amortization of intangible assets, amortization of acquisition-related intangibles, expensing of inventory fair market value step-up, inventory write downs, purchased in-process research and development expenses, inventory valuation adjustments, restructuring, asset impairments and other, net, goodwill impairment charges, gains and losses on debt prepayment, income tax adjustments to approximate cash taxes, non-cash interest expense, their related tax effects and certain other special items as appropriate.

**** Regulation G and other provisions of the securities laws regulate the use of financial measures that are not prepared in accordance with GAAP. We believe these non-GAAP measures provide important supplemental information to investors. We use these measures, together with GAAP measures, for internal managerial purposes and as a means to evaluate period-to-period comparisons. However, we do not, and you should not, rely on non-GAAP financial measures alone as measures of our performance. We believe that non-GAAP financial measures reflect an additional way of viewing aspects of our operations that – when taken together with GAAP results and the reconciliations to corresponding GAAP financial measures that we also provide in our releases – provide a more complete understanding of factors and trends affecting our business. Because non-GAAP financial measures are not standardized, it may not be possible to compare these financial measures with other companies’ non-GAAP financial measures, even if they have similar names.

Teleconference

ON Semiconductor will host a conference call for the financial community at 5:00 p.m. Eastern Time (ET) on February 8, 2012, to discuss this announcement and ON Semiconductor’s fourth quarter and 2011 annual results. The company will also provide a real-time audio webcast of the teleconference on the Investor Relations page of its website at www.onsemi.com. The webcast replay will be available at this site approximately one hour following the live broadcast and will continue to be available for approximately 30 days following the conference call. Investors and interested parties can also access the conference call through a telephone call by dialing (888) 546-9664 (U.S./Canada) or (973) 935-8144 (International). In order to join this conference call, you will be required to provide the Conference ID Number – which is 48965565. Approximately one hour following the live broadcast, the company will provide a dial-in replay that will continue to be available through February 15, 2012. To listen to the teleconference replay, call (855) 859-2056 (U.S./Canada) or (404) 537-3406 (International). You will be required to provide the Conference ID Number – which is 48965565.

About ON Semiconductor

ON Semiconductor (Nasdaq: ONNN) is a premier supplier of high performance, silicon solutions for energy efficient electronics. The company’s broad portfolio of power and signal management, logic, discrete and custom devices helps customers effectively solve their design challenges in automotive, communications, computing, consumer, industrial, LED lighting, medical, military/aerospace and power applications. ON Semiconductor operates a world-class, value-added supply chain and a network of manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe, and the Asia Pacific regions. For more information, visit www.onsemi.com.

PHOENIX– ON Semiconductor Corporation (Nasdaq: ONNN):

For the fourth quarter of 2011, highlights include:

Total revenues of approximately $767.9 million

GAAP gross margin of 31.1 percent

Non-GAAP gross margin of 32.9 percent

GAAP net loss per fully diluted share of $0.02

Non-GAAP net income per fully diluted share of $0.13

Record cash, cash equivalents and short-term investments of $901.5 million

Completed a $325 million five-year senior revolving credit facility

Extended debt maturity of $198.6 million of 2.625% convertible senior subordinated notes from December 2013 to December 2016 via a notes exchange

For 2011, highlights include:

Record total revenues of approximately $3.442 billion, up approximately 49 percent compared to 2010

Record adjusted EBITDA of $626.7 million

ON Semiconductor Corporation (Nasdaq: ONNN) today announced that total revenues in the fourth quarter of 2011 were $767.9 million, a decrease of approximately 14 percent from the third quarter of 2011. During the fourth quarter of 2011, as previously indicated, the company was negatively impacted from the flood in Thailand. During the fourth quarter of 2011, the company reported a GAAP net loss of $8.8 million, or $0.02 per fully diluted share. The fourth quarter 2011 GAAP net loss was impacted by $67.2 million of special items which include restructuring, asset impairment and other charges, which were primarily related to the Thailand flood and charges associated with the convertible notes exchange. The complete special item details can be found in the attached schedules.

Fourth quarter 2011 non-GAAP net income was $58.4 million, or $0.13 per share on a fully diluted basis. Third quarter 2011 non-GAAP net income was $110.5 million, or $0.24 per share on a fully diluted basis. A reconciliation of these non-GAAP financial measures (and other non-GAAP measures used elsewhere in this release, such as non-GAAP gross margin and adjusted EBITDA) to the company’s most directly comparable measures prepared in accordance with U.S. GAAP are set forth in the attached schedules and on our website at www.onsemi.com/.

On a mix-adjusted basis, average selling prices for ON Semiconductor in the fourth quarter of 2011 were down approximately two to three percent when compared to the third quarter of 2011. Total company GAAP gross margin in the fourth quarter was 31.1 percent. Total company GAAP gross margin in the fourth quarter included a net charge of approximately $13.3 million, or approximately 180 basis points, from special items including the Thailand related inventory write down. Total company non-GAAP gross margin in the fourth quarter was 32.9 percent.

Adjusted EBITDA for the fourth quarter of 2011 was $122.0 million. Adjusted EBITDA for the third quarter of 2011 was $169.9 million.

Total revenues for 2011 were a record $3.442 billion, an increase of approximately 49 percent from $2.313 billion in 2010. During 2011, the company reported GAAP net income of $11.6 million, or $0.03 per fully diluted share. The 2011 GAAP net income included net charges of $383.5 million from special items. During 2010, the company reported GAAP net income of $290.5 million, or $0.65 per fully diluted share. The 2010 GAAP net income included net charges of $105.3 million from special items. The special item details can be found in the attached schedules.

The non-GAAP net income for 2011 was $395.1 million, or $0.86 per share on a fully diluted basis. The non-GAAP net income for 2010 was $395.8 million, or $0.89 per share on a fully diluted basis.

The company’s GAAP gross margin in 2011 was 29.3 percent. GAAP gross margin in 2011 included a net charge of approximately $190.8 million, or approximately 550 basis points, from special items. Non-GAAP gross margin in 2011 was 34.8 percent. The company’s GAAP gross margin in 2010 was 41.3 percent. GAAP gross margin in 2010 included a net charge of approximately $10.4 million, or approximately 50 basis points, from special items. Non-GAAP gross margin in 2010 was 41.8 percent. The special item details can be found in the attached schedules.

“2011 was a transformational year for the company,” said Keith Jackson, ON Semiconductor president and CEO. “During the year we completed the acquisitions of SANYO Semiconductor and the CMOS Image Sensor Business Unit. We achieved record annual revenues and adjusted EBITDA in 2011 and ended the year with our highest cash, cash equivalents and short-term investments in our history at over $900 million. After a challenging second half of 2011 for the industry and ON Semiconductor, we believe that the first quarter of 2012 represents the bottom of the current semiconductor cycle.”

First Quarter 2012 Outlook

“During the fourth quarter, the company faced significant challenges related to the flood in Thailand and the resulting damage to our SANYO Semiconductor manufacturing facilities located in that country,” Jackson said. “Our SANYO Semiconductor segment revenue in the first quarter of 2012 will continue to be negatively impacted by lower production capacity as a result of the Thailand flood. We are, however, expecting SANYO Semiconductor revenues to be approximately flat compared to the fourth quarter of 2011 as orders that were fulfilled out of finished goods inventory in the fourth quarter of 2011 will begin to be fulfilled from production capacity at other locations within our global internal and external manufacturing network in the first quarter of 2012. We also believe that the historical ON Semiconductor business will be seasonally down in the first quarter of 2012.”

“Based upon product booking trends, backlog levels and estimated turns levels, we anticipate that total ON Semiconductor revenues will be approximately $720 to $760 million in the first quarter of 2012,” Jackson said. “Backlog levels for the first quarter of 2012 represent approximately 80 to 85 percent of our anticipated first quarter 2012 revenues. We expect that average selling prices for the first quarter of 2012 will be down approximately two to three percent when compared to the fourth quarter of 2011. The non-GAAP outlook for the first quarter of 2012 includes stock-based compensation expense of approximately $8 to $10 million.”

The following table outlines ON Semiconductor’s projected first quarter of 2012 GAAP and non-GAAP outlook.

On Semiconductor Q1 2012 Business Outlook

Total ON Semiconductor Special Total ON Semiconductor

GAAP Items *** Non-GAAP****

Revenue $720 to $760 million $720 to $760 million

Gross Margin 31.5% to 32.5% 31.5% to 32.5%

Operating Expenses $195 to $200 million $15 million $180 to $185 million

Net Interest Expense / Other Expenses $12 million $12 million

Convertible Notes, Non-cash Interest Expense* $9 million $9 million $0 million

Tax $4 to $5 million $4 to $5 million

Fully Diluted Share Count ** 460 million 460 million

* Convertible Notes, Non-cash Interest Expense is pursuant to FASB’s Accounting Standards Codification (“ASC”) Topic 470: Debt.

** Fully diluted share count can vary for, among other things, the actual exercise of options or restricted stock units, the incremental dilutive shares from all of the company’s convertible senior subordinated notes, and the repurchase or the issuance of stock or convertible notes or the sale of treasury shares. Please refer to the table on our website for potential changes to the Fully Diluted Share Count. This table can be found on our website at www.onsemi.com under Investors – Investor Relations, Quarterly Results.

*** Special Items can include: amortization of intangible assets, amortization of acquisition-related intangibles, expensing of inventory fair market value step-up, inventory write downs, purchased in-process research and development expenses, inventory valuation adjustments, restructuring, asset impairments and other, net, goodwill impairment charges, gains and losses on debt prepayment, income tax adjustments to approximate cash taxes, non-cash interest expense, their related tax effects and certain other special items as appropriate.

**** Regulation G and other provisions of the securities laws regulate the use of financial measures that are not prepared in accordance with GAAP. We believe these non-GAAP measures provide important supplemental information to investors. We use these measures, together with GAAP measures, for internal managerial purposes and as a means to evaluate period-to-period comparisons. However, we do not, and you should not, rely on non-GAAP financial measures alone as measures of our performance. We believe that non-GAAP financial measures reflect an additional way of viewing aspects of our operations that – when taken together with GAAP results and the reconciliations to corresponding GAAP financial measures that we also provide in our releases – provide a more complete understanding of factors and trends affecting our business. Because non-GAAP financial measures are not standardized, it may not be possible to compare these financial measures with other companies’ non-GAAP financial measures, even if they have similar names.

Teleconference

ON Semiconductor will host a conference call for the financial community at 5:00 p.m. Eastern Time (ET) on February 8, 2012, to discuss this announcement and ON Semiconductor’s fourth quarter and 2011 annual results. The company will also provide a real-time audio webcast of the teleconference on the Investor Relations page of its website at www.onsemi.com. The webcast replay will be available at this site approximately one hour following the live broadcast and will continue to be available for approximately 30 days following the conference call. Investors and interested parties can also access the conference call through a telephone call by dialing (888) 546-9664 (U.S./Canada) or (973) 935-8144 (International). In order to join this conference call, you will be required to provide the Conference ID Number – which is 48965565. Approximately one hour following the live broadcast, the company will provide a dial-in replay that will continue to be available through February 15, 2012. To listen to the teleconference replay, call (855) 859-2056 (U.S./Canada) or (404) 537-3406 (International). You will be required to provide the Conference ID Number – which is 48965565.

About ON Semiconductor

ON Semiconductor (Nasdaq: ONNN) is a premier supplier of high performance, silicon solutions for energy efficient electronics. The company’s broad portfolio of power and signal management, logic, discrete and custom devices helps customers effectively solve their design challenges in automotive, communications, computing, consumer, industrial, LED lighting, medical, military/aerospace and power applications. ON Semiconductor operates a world-class, value-added supply chain and a network of manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe, and the Asia Pacific regions. For more information, visit www.onsemi.com.

GREENSBORO, N.C.– TE Connectivity has introduced a new Video Distribution System (VDS) that enables network managers to deliver true high-definition RF and IP video over an existing data cabling infrastructure without the need for coaxial cabling or any RF tuning.

VDS enables the delivery of video signals such as cable television, satellite, in-house video, digital signage, electronic bulletin boards or any other service normally delivered over coaxial systems – over a Category 6 or higher twisted-pair infrastructure. The VDS eliminates the need for a separate coaxial infrastructure or the need for an RF technician to install it.

“We’re finding that simultaneous access to data, video and other high-bandwidth services is becoming a necessity for many of our customers – especially in the financial services, healthcare, and education industries,” commented Kam Patel, product management director for emerging technologies at TE Enterprise Networks. “High-definition RF and IP video are becoming commonplace.”

Delivering rich content in the form of high-definition video has often been a challenge for network managers as it typically means overlaying their twisted-pair infrastructure with an additional, coaxial infrastructure.

Patel continued, “Now, with TE’s new video distribution system, we have effectively eliminated the time and expense associated with this additional layer of infrastructure. VDS allows anyone to access these services, including high-definition or IP video, wherever they have a network outlet.”

The TE Connectivity VDS solution is TIA-568/ISO 11801 compliant and delivers broadband RF signals over an existing structured cabling infrastructure. It supports full-spectrum video (862 MHz) for up to 295 feet or 550 MHz for up to 328 feet. VDS is a true “plug and play” system for greater ease of installation and maintenance and features automatic gain control. Using self-adjusting baluns to provide amplification and equalization, output and input levels are adjusted to provide perfect HD video at the TV set. The system automatically adjusts the head-end signal for proper system operation and thereby eliminates the need for manual tuning by solving equalization and balancing issues traditionally associated with coaxial systems.

Patel adds: “This is a significant addition to TE Connectivity’s Enterprise Networks portfolio. It solves one of the biggest headaches for network managers who are trying to integrate video distribution across an existing twisted pair infrastructure – and it provides a future-proofed solution for the longer-term migration to IPTV.” For more information about TE’s video distribution system, visit: www.te.com/en/general/video-distribution-system[...].

About TE Connectivity

TE Connectivity is a global, $14 billion company that designs and manufactures approximately 500,000 products that connect and protect the flow of power and data inside the products that touch every aspect of our lives. Our nearly 100,000 employees partner with customers in virtually every industry—from consumer electronics, energy and healthcare, to automotive, aerospace and communication networks—enabling smarter, faster, better technologies to connect products to possibilities. More information on TE Connectivity can be found at www.te.com.

TE Enterprise Networks infrastructure solutions connect people and technology across office networks and data centers. Many of the world’s most complex data networks run applications at speeds of up to 100Gbps over products from TE’s AMP NETCONNECT and ADC portfolios. More information can be found at: www.ampnetconnect.com

PHOENIX– Avnet, Inc. (NYSE:AVT), a leading global technology distributor, today announced that the company is a recipient of the 2011 Showcase in Excellence Award from the Arizona Quality Alliance for its Avnet Global Solutions Center 5S processes. Avnet implemented these processes into the Chandler, Ariz. integration center as part of its commitment to operational excellence. Avnet received this recognition today during an awards banquet, which was keynoted by Janice K. Brewer, Governor of Arizona.

“Avnet is committed to realizing the highest levels of operational excellence in everything we do,” said Gerry Fay, chief global logistics and operations officer at Avnet. “The Avnet Global Solutions Center team earned this recognition from the Arizona Quality Alliance which demonstrates our team’s ability to create efficient work environments that deliver high-quality solutions to our customers.”

The 2011 Showcase in Excellence Award recognizes organizations for specific process excellence. Avnet was recognized for implementing a highly effective 5S program that has improved computer integration cycle time, increased production capacity, and increased revenue per employee. The 5S process methodology enhances productivity by keeping production environments efficiently organized and assigning work and equipment specific locations to maximize ease of use and speed of operation.

During the past 10 years, Avnet has been supplying more solutions-based products that integrate all of a customer’s technology needs into one package. These all-in-one solutions have been growing in complexity over time, sometimes including thousands of components and sub-assemblies connected with complex software. To address this complexity, Avnet was able to utilize 5S processes to increase efficiencies and refine its flexible production environment while enhancing the professional appearance of its production area.

In a 5S workplace each employee, or team, has ownership of an area and is held accountable for maintaining a clean and organized work area. The Avnet project identified all the tools and materials needed at each workstation, while extraneous items were removed and remaining items were analyzed for frequency of use. These items were then standardized for all workstations, put on workstation display boards, and “shadow boxed” with those used most frequently placed nearest the employee. This enabled employees to efficiently perform any computer system integration work assignment at any workstation, resulting in greater production flexibility within the integration center. The team also created a workstation auditing and scoring process consisting of management and employees to provide feedback and measure consistency.

Avnet’s results from implementing the 5S processes included:

Improved workflow addressing the complexities created by all-in-one technology solutions

Improved cycle time by 55 percent

Increased productivity per employee by 16 percent

Improved complex builds capacity by 30 percent

The annual Arizona Performance Excellence Award Program recognizes Arizona organizations for performance excellence. The program was established for all Arizona organizations, manufacturing or service, profit or not-for-profit, private or public sector, local, state or federal. Modeled after the Malcolm Baldrige National Quality Award criteria, the program provides recognition and valuable feedback to organizations pursuing operational excellence.

About Avnet

Avnet, Inc. (NYSE: AVT), a Fortune 500 Company, is one of the largest distributors of electronic components, computer products and embedded technology serving customers in more than 70 countries worldwide. Avnet accelerates its partners’ success by connecting the world’s leading technology suppliers with a broad base of more than 100,000 customers by providing cost-effective, value-added services and solutions. For the fiscal year ended July 2, 2011, Avnet generated revenue of $26.5 billion. For more information, visit www.avnet.com.

CAMBRIDGE, England–(BUSINESS WIRE)–Nujira Ltd, the world leader in Envelope Tracking technology, has launched the first IC in its Coolteq.L product family of Envelope Tracking (ET) power supply modulators for mobile handsets. Nujira’s NCT-L1100 has been developed by the industry’s largest and most experienced ET team, delivering a chip that reduces wasted energy from power amplifiers (PAs) in mobile handsets by more than 50%, cutting heat dissipation and extending battery life.

Reducing the power consumption of PAs is one of the key challenges facing 3G and 4G smartphone OEMs as demand for higher data rates continues to drive network standards. The improved spectral efficiency of the 4G LTE standard enables higher data bandwidth, but comes at the price of reduced energy efficiency in the RF PA. Further penalties come from an increase in the average RF power transmitted from the handset, and the need to support an increasing number of frequency bands in the phone to support global roaming. This not only impacts on battery life, but also on handset temperature – a growing problem for smartphone designers. Unaddressed, these issues will degrade the user experience and delay the adoption of 4G smartphones.

“Battery life has always been a key factor for consumers when it comes to mobile handsets, and it is a regular complaint from users of the latest smartphones. 4G handsets may need to be charged two or three times a day, which will have a catastrophic impact on user adoption,” commented Tim Haynes, CEO, Nujira. “The industry consensus is that Envelope Tracking will become the standard PA architecture for the next generation of handsets, because it is the only power optimization technology which delivers high efficiency over the entire spectrum used for 3G and 4G standards. As a result we see the launch of our first commercial chip for mobile handsets as a significant milestone, not just for Nujira, but for the mobile handset sector.”

Nujira’s NCT-L1100 demonstrates power conversion efficiencies in excess of 80% and supports the maximum 20MHz channel bandwidth of LTE – the best available on the market today. The technology has already been validated through system integration with two major platform chipset vendors, and Nujira will be demonstrating the NCT-L1100 at Mobile World Congress in Barcelona, Spain, February 27-March 1st.

The new Coolteq.L chip is compatible with multiple air interface standards, including TDD and FDD LTE. Nujira’s ISOGAIN™ linearization technology delivers improved ACLR and EVM performance, eliminating antenna load mismatch and providing additional output power from the PA. The NCT-L1100 features the industry-standard OpenET analog envelope interface, and a MIPI RFFE control interface.

Production devices will be available in small footprint WLCSP packages. Nujira provides platform chipset vendors with evaluation boards and engineering support for integration into reference designs for smartphones and data devices.

The NCT-L1100 is sampling now to lead partners with general availability in Q4 2012.

The ‘ElectroTestExpo’ consortium is pleased to announce a series of dates for its regional test exhibition and seminars to be held throughout 2012. For its third year of free-to-attend events ElectroTestExpo will initially kick-off its unique combination of drop-in tabletop exhibitions and seminar programmes at three UK venues; starting at Gloucester Premiership Rugby Club on February 22nd. Events have also been provisioned for later in the year in Cambridge and Edinburgh.

The events will feature a series of talks by industry experts tackling a range of topics in an easily accessible and relaxed environment. Exhibitors currently include Tektronix, GeoTest, AmFax, JTAG Technologies, Aeroflex, MAC Panel, Pico Technology, Polar Instruments, TestWorks and Pickering Interfaces.

Speaking on behalf of the consortium James Stanbridge commented: “Following two successful years at the popular Bletchley Park we have decided to bring ourselves into closer contact by visiting some more convenient locations for our visitors.”

Each venue will include a seminar room that will allow vendor-appointed speakers to discuss the latest trends in their industry sectors. Each talk will last 40 minutes, and the running order and topics will be posted on the event web-site www.electrotestexpo.co.uk.

Consortium member Nigel Adams adds: “The challenges in today’s test environment require a more focussed approach to the traditional wide ranging exhibition. ElectroTestExpo is the event that is specifically aimed to address the needs of engineers looking to reduce cost and test times but maintain measurement quality. Aeroflex is pleased to support this event.”

The event is open to all electronic engineering professionals however the organisers reserve the right of admission to unsuitable applicants.

Multitest announces that Jim Brandes, Product Manager, will hold a presentation titled “Specmanship” at the upcoming Burn-in & Test Socket Workshop, scheduled to take place March 4-7, 2012 Mesa, AZ.

Specsmanship is the art of improving the appearance of technical specifications which, once improved, may no longer reflect reality. Different specifications to be discussed include RF, DC and mechanical.

The presentation will provide several examples of specsmanship, and also present three examples of test reports which thoroughly explain the origins of several specifications with explanations of the test methods used to derive them — the way specifications should be created and presented to users.

Energy Micro has announced it has gained ISO 9001:2008 registration of its quality management system for the design and manufacture of its range of energy friendly microcontrollers and RF radios. The certificate of registration to the quality standard was awarded to Energy Micro by the certification body Det Norske Veritas (DNV).

Zalina Shaher, Energy Micro’s VP of Operations said, “The process of ISO 9001:2008 certification gives us a great platform to comprehensively test out the way in which the existing Energy Micro Quality Management System had been designed, documented and implemented and moving forward will ensure long term commitment to our continual improvement in quality and customer satisfaction.”

“With no major findings from the document review, through to just a single minor finding in the initial audit, Energy Micro has performed professionally and consistently throughout the certification process,” said the lead auditor for DNV, Ingebjørg Gravlien. “I have been particularly impressed with how quickly such a young company has been able to implement the standard and just how committed its employees are to the latest thinking in quality procedures.”

Published by the International Organisation for Standards, ISO 9001:2008 is the latest and most comprehensive version of the ISO9001 quality standard, an internationally recognised framework for the creation and maintenance of quality management systems aimed at achieving improvements in business performance and customer satisfaction.

Tensilica, Inc. today announced that the NatureDSP Math Library from IntegrIT DSP Design House, a leading supplier of DSP (digital signal processing) software solutions, is now available for Tensilica’s ConnX BBE16 baseband DSP for system-on-chip (SOC) design.

The IntegrIT NatureDSP Math library simplifies the software development process for design teams that want to port their own signal processing application software to the ConnX BBE16 DSP. The IntegrIT Nature DSP Signal+ is a collection of signal processing routines needed for implementation of typical digital signal processing functions including highly optimised routines for filtering, FFT, matrix, trigonometric and other math operations.

“Tensilica’s ConnX BBE16 DSP has been selected by several major communications suppliers,” stated Dmitry Paroshin, managing partner, IntergIT. “Now, with this library, developers will get an additional choice of high-performance math functions that will speed their development efforts. Customers can reach the full computational power of the BBE16 DSP with their application software thanks to the useful and optimised algorithmic kernels of the library.”

“IntegrIT has a proven track record in providing high-quality DSP libraries,” stated Eric Dewannain, Tensilica’s vice president and general manager, baseband business unit. “This library will speed our mutual customers’ software development times significantly.”