Patrick Hopper interviews u-blox at booth during TU Automotive Detroit 2016
Embedded Computing Publisher Patrick Hopper interviews Franck Berny, senior principal product strategy at Ublox, during TU Automotive Detroit 2016.
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Aicas and Klika Tech Showcase Alexa Auto at Embedded World 2019
The companies will introduce the seamless integration of aicas’ JamaicaCAR Framework and Amazon Alexa Auto as a demonstration for the auto industry.
Toshiba Information Systems (JAPAN) initiates Strategic Partnership with DiSTI Corporation in Japan
Toshiba Information Systems (JAPAN) signs reseller agreement with DiSTI to begin the sales and support of the GL Studio UI Development Tool for Embedded Systems in Japan.
Embedded World 2019 Best in Show Award Nominees: Storage
Embedded Computing Design's Best in Show Awards recognize innovative solutions for electronics engineers that will be showcased at Embedded World 2019. Here, we outline Storage and Memory.
Embedded World 2019 Best in Show Award Nominees: Power Electronics
Embedded Computing Design's Best in Show Awards recognize innovative solutions for electronics engineers that will be showcased at Embedded World 2019. Here, we outline Power Electronics.
Embedded World 2019 Best in Show Award Nominees: Development Tools
Embedded Computing Design's Best in Show Awards recognize innovative solutions for electronics engineers that will be showcased at Embedded World 2019. Here, we outline Development Tools.
OSS’ Bressner Will Appear at Embedded World 2019
One Stop Systems, Inc.’s subsidiary, Bressner Technology GmbH will be attending Embedded World Exhibition & Conference.
Vicor’s Four New DC-DC Converter Chip Modules Hit the Market
Vicor’s new 80W DCM ChiPs include a wide-input voltage range of 9V to 75V and are available with nominal output voltages of 12V, 24V, 28V and 48V.
Microchip’s PCIe 3.1 Ethernet Bridges Save Power for Embedded and Automotive Platforms
Microchip Technology announced the LAN7430 and LAN7431 PCIe 3.1 Ethernet bridges with Low-Power Sub-State (LPSS) L1.1 and L1.2 for power savings.
DiSTI Announces Partnership with Telechips
DiSTI and Telechips partnership highlights GL Studio UI technology running on the Dolphin+ Hardware.
NXP Showcasing Neutral Networking, AI, and Autonomous Driving Products at Embedded World 2019
NXP Semiconductors will showcase various technologies for a collection of AI-related applications at embedded world 2019.
Navigating Mixed-Criticality Requirements of Integrated ADAS and Infotainment
As the autonomous vehicle functions allow drivers and passengers to increasingly devote their attention to something other than the road, infotainment systems will become the focal point.
UltraSoC to Present Extended Embedded Analytics Architecture at embedded world
UltraSoC will present its extended embedded analytics architecture at embedded world.
Autonomous Vehicle Timing Means MEMS
Engineering is always about tradeoffs, but autonomous vehicles are pushing that to the limit with conflicting requirements.
The Silent Power of Supercapacitors
Supercapacitors are almost everywhere, although perhaps because they are seen as passive components with a low-tech connotation, they are seldom on stage front.
VE Studio 2019.1 Commercial Release Now Available
The latest release speeds desktop and VR-based virtual training content development and lowers project costs using model import wizards, simplified lesson authoring, an improved UI, and...
Acer Cloud Technology Debuts Being Device Management
Acer Cloud Technology has joined forces with smart system suppliers Axiomtek, NEXCOM, IBASE, Shuttle, and AOPEN to provide an all-in-one device management platform.
ACEINNA Launches Industry's First High Accuracy Current Sensors based on AMR Technology
ACEINNA's new MCx1101 family of ±5A, ±20A, and ±50A Current Sensors for industrial and power supply applications are the first high accuracy wide bandwidth AMR-based current sensors on the market,...
Vecow Showcases Smarter Industrial AI Engines At Embedded World 2019
Featuring Smarter Industrial AI Engines, Vecow would like to share you her latest solutions for industrial AI computing at Embedded World 2019 from February 26th to 28th, Nuremberg, Germany. The...
VIA Mobile360 ADAS System Introduced at Embedded World 2019
Via Technologies, Inc. will be attending embedded world 2019 to exhibit VIA Mobile360 ADAS, their Edge AI solution for smart transportation.
Wolfspeed’s New Sic Diode Targets Renewable Energy, Electric Vehicle Apps