Innodisk booth interview at TU Automotive Detroit 2016
Embedded Computing Publisher Patrick Hopper interviews Russell Chen, field application engineer at Innodisk, during TU Automotive Detroit 2016.
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ON Semiconductor Demonstrates Strata Developer Studio at Embedded World
ON Semiconductor will be exhibiting its newly-launched Strata Developer Studio design support tool at embedded world.
NanoLock and Cypress to Appear at Embedded World to Exhibit Security for Automotive and Industrial Applications
NanoLock Security and Cypress Semiconductor Corp. will be attending embedded world to exhibit their flash-based solutions that bring device-level security and management.
Cadence and Green Hills Software Announce Partnership to Accelerate Embedded System Safety and Security
Cadence Design Systems, Inc. and Green Hills Software just announced a strategic partnership that is expected to leverage their respective strengths to drive embedded system safety and security.
Vision Components Will Appear at embedded world to Showcase Ultracompact Camera Modules
Vision Components will be attending Embedded World 2019 from February 26-28 in Nuremberg, Germany in Hall 3, stand 764, to exhibit its line of MIPI camera modules.
Green Hills Software to Showcase Its Innovative Security and Safety-critical Solutions at embedded world
Green Hills Software will showcase their technology for automotive electronics and secure IoT devices at embedded world.
Maxim Empowering Design Innovation at embedded world 2019
See wearable healthcare, IoT and security demos that will inspire big thinking for small designs.
Taking the Billion-Mile Test to Autonomous Drive
Autonomous vehicles encompass a wide variety of subsystems that must be checked for performance, accuracy, and functional safety. Automakers are turning to simulation to reduce cost and time to market
HCC Embedded Launches First Reusable Software Element Developed "Out of Context" for Safety-Critical Systems
HCC SafeTCPIP is an industry-first, off-the-shelf network stack for integration with automotive systems that require a high safety-integrity level
Clientron to display its latest embedded computing solutions at Embedded World 2019
Clientron Corp., a world-leading supplier of thin client and embedded systems, will proudly present its embedded computing solutions for smart parking, food industry and factory automation...
Aicas and Klika Tech Showcase Alexa Auto at Embedded World 2019
The companies will introduce the seamless integration of aicas’ JamaicaCAR Framework and Amazon Alexa Auto as a demonstration for the auto industry.
Toshiba Information Systems (JAPAN) initiates Strategic Partnership with DiSTI Corporation in Japan
Toshiba Information Systems (JAPAN) signs reseller agreement with DiSTI to begin the sales and support of the GL Studio UI Development Tool for Embedded Systems in Japan.
Embedded World 2019 Best in Show Award Nominees: Storage
Embedded Computing Design's Best in Show Awards recognize innovative solutions for electronics engineers that will be showcased at Embedded World 2019. Here, we outline Storage and Memory.
Embedded World 2019 Best in Show Award Nominees: Power Electronics
Embedded Computing Design's Best in Show Awards recognize innovative solutions for electronics engineers that will be showcased at Embedded World 2019. Here, we outline Power Electronics.
OmniVision Announces Its First 0.8 Micron, 32 Megapixel Image Sensor
The OV32A is OmniVision's first 0.8 micron pixel image sensor with 32 megapixel (MP) resolution, built on OmniVision's PureCel(r) Plus stacked die technology.
Embedded World 2019 Best in Show Award Nominees: Development Tools
Embedded Computing Design's Best in Show Awards recognize innovative solutions for electronics engineers that will be showcased at Embedded World 2019. Here, we outline Development Tools.
OSS’ Bressner Will Appear at Embedded World 2019
One Stop Systems, Inc.’s subsidiary, Bressner Technology GmbH will be attending Embedded World Exhibition & Conference.
Vicor’s Four New DC-DC Converter Chip Modules Hit the Market
Vicor’s new 80W DCM ChiPs include a wide-input voltage range of 9V to 75V and are available with nominal output voltages of 12V, 24V, 28V and 48V.
Microchip’s PCIe 3.1 Ethernet Bridges Save Power for Embedded and Automotive Platforms
Microchip Technology announced the LAN7430 and LAN7431 PCIe 3.1 Ethernet bridges with Low-Power Sub-State (LPSS) L1.1 and L1.2 for power savings.
DiSTI Announces Partnership with Telechips
DiSTI and Telechips partnership highlights GL Studio UI technology running on the Dolphin+ Hardware.
NXP Showcasing Neutral Networking, AI, and Autonomous Driving Products at Embedded World 2019