1 through 12 of 12 articles found
PC/104 and Small Form Factors
COM Express Design Guide improves interoperability
By Christian Eder (congatec AG)
Summary:
PICMG introduces a "cookbook" for carrier board designers.
PICMG introduces a "cookbook" for carrier board designers.
PC/104 and Small Form Factors
COM Express: More features, more to consider
By Bob Pebly (RadiSys)
Summary:
The revised COM Express standard will address new and evolving digital display interfaces, legacy obsolescence issues, SPI, and support for HD Audio.
The revised COM Express standard will address new and evolving digital display interfaces, legacy obsolescence issues, SPI, and support for HD Audio.
White Paper
COM Express Carrier Design Guide
By PICMG (PICMG)
Summary:
The COM Express™ Carrier Design Guide: Guidelines for designing COM Express™ Carrier Boards, March 13, 2009 (Rev. 1.0) is a design guide and not a specification. It contains additional detail information but does not replace the PICMG COM Express™ (COM.0) specification.
The COM Express™ Carrier Design Guide: Guidelines for designing COM Express™ Carrier Boards, March 13, 2009 (Rev. 1.0) is a design guide and not a specification. It contains additional detail information but does not replace the PICMG COM Express™ (COM.0) specification.
CompactPCI and AdvancedTCA Systems
COM Express gains a major interoperability boost
By Jeff Munch (Ampro ADLINK Technology, Inc.)
Summary:
New PICMG Carrier Design Guide (CDG) enables carriers that work with multiple vendors’ modules
New PICMG Carrier Design Guide (CDG) enables carriers that work with multiple vendors’ modules
PC/104 and Small Form Factors
Economies of scale helping low-volume design and manufacturing
By Wade Clowes (RadiSys Corporation)
Summary:
COM Express provides the cost and technology benefits of high-volume design and manufacturing to smaller-volume products.
COM Express provides the cost and technology benefits of high-volume design and manufacturing to smaller-volume products.
CompactPCI and AdvancedTCA Systems
Book: COM Express for Dummies
By Keith Underdahl (RadiSys Corporation and Intel Corporation)
Summary:
FEATURED BOOK – In this handy guide, read about how COMs offer a modular, highly integrated computer design that can be adapted to almost any use.
FEATURED BOOK – In this handy guide, read about how COMs offer a modular, highly integrated computer design that can be adapted to almost any use.
PC/104 and Small Form Factors
Peripheral guidance for compatibility-challenged COM Express designs
By Jeff Munch (Adlink Technology)
Summary:
A recently formed PICMG subcommittee is endeavoring to increase compatibility among COM Express modules by defining a set of carrier design guidelines.
A recently formed PICMG subcommittee is endeavoring to increase compatibility among COM Express modules by defining a set of carrier design guidelines.
CompactPCI and AdvancedTCA Systems
Successful carrier card design for COM Express: An introduction to high-speed serial bus interface desig
By Jennifer Zickel (RadiSys Corporation)
Summary:
Here is a carefully detailed starting point of design considerations for COM Express.
Here is a carefully detailed starting point of design considerations for COM Express.
CompactPCI and AdvancedTCA Systems
COM-onomics: The economics and use of COM Express in embedded applications
By Doug Mays (Diversified Technology Inc.)
Summary:
Why juggling performance, size, I/O, and thermal management demands has designers turning to COM Express for relief.
Why juggling performance, size, I/O, and thermal management demands has designers turning to COM Express for relief.
PC/104 and Small Form Factors
XTX versus COM Express – the gloves come off
By Colin McCracken (Ampro)
Summary:
Vendors choose sides as a battle for supremacy is looming, brought on by PCI Express.
Vendors choose sides as a battle for supremacy is looming, brought on by PCI Express.
PC/104 and Small Form Factors
An introduction to COM Express modules
By Christine Howe (Kontron)
Summary:
COM Express creates endless possibilities for new embedded applications
COM Express creates endless possibilities for new embedded applications
CompactPCI and AdvancedTCA Systems
COM Express: The next generation Computer-On-Module standard
By Bob Pebly (RadiSys Corporation)
Summary:
In this article Bob outlines Computer-On-Module (COM) advantages and discusses the ripple effect movements from legacy and parallel bus interfaces to high-speed differential serial interconnects have had on standard form factors.... (continues)
In this article Bob outlines Computer-On-Module (COM) advantages and discusses the ripple effect movements from legacy and parallel bus interfaces to high-speed differential serial interconnects have had on standard form factors.... (continues)
