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  • The Liger VL-EPM-43 SBC features Intel’s Kaby Lake dual core processor in a PC104 form factor.

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  • Spectre and Meltdown: A new breed of vulnerability

    Spectre and Meltdown: A new breed of vulnerability

    The obvious way to eliminate Spectre/Meltdown vulnerabilities is eliminating the optimizations they exploit. But the reason these CPU optimizations exist – they dramatically increase performance!

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  • DICE offers enhanced security and unique device identification

    DICE relies on a combination of simple silicon capabilities and software techniques that work together to provide a cryptographically strong device identity.

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  • Littelfuse over-temperature protection device handles higher currents in a small package

    Littelfuse over-temperature protection device handles higher currents in a small package

    The device is designed to help meet the battery safety requirements of the higher-capacity lithium ion polymer and prismatic battery cells found in portable, battery-powered consumer products.

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  • UL accepts HARTING Technology Group into Client Test Data Program

    UL accepts HARTING Technology Group into Client Test Data Program

    The Client Test Data program allows HARTING to test products in its own in-house test laboratory and submit the data to UL to streamline the certification process.

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  • Embedded Insiders Podcast – CES 2018: Coughs, Cortanas, and Cars That Aren't Connected

    Embedded Insiders Podcast – CES 2018: Coughs, Cortanas, and Cars That Aren't Connected

    The Insiders encountered problems with the term "connected car," listened into advances in digital signal processing for virtual assistants, and heard that LiDAR is a bunch of sh**.

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  • Mind the gap: Going from reference board prototype to production system

    Embedded systems designers need to look beyond prototypes at how they will be transformed into products. The path from prototype to a production-worthy design is not as simple as one might expect.

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  • Key indicators and inflection points for embedded engineers and IT

    Key indicators and inflection points for embedded engineers and IT

    This sets the stage in 2018 to progress the Internet of Things (IoT) trend from a grouping of technical embedded device, network, and cloud capabilities to a mesh capable of paradigm-altering results.

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  • GLF’s ultra-low-power battery protection IC targets wearables and small IoT devices

    GLF’s ultra-low-power battery protection IC targets wearables and small IoT devices

    The GLF7310IQ offers added savings of up to 10% in battery life and a smaller footprint than legacy solutions.

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  • Saelig Introduces RSA5000 3.2/6.5GHz Real-Time Spectrum Analyzers

    Saelig Introduces RSA5000 3.2/6.5GHz Real-Time Spectrum Analyzers

    These real-time devices scan a complete frequency spectrum of 9kHz to 3.2 or 6.5GHz with a maximum sample rate of 51.2MS/s and are ideal for monitoring intermittent and frequency-hopped wireless...

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  • Microchip’s ATECC608A secure element and Partner Program aid in security

    Microchip’s ATECC608A secure element and new Security Design Partner Program provide the parts and partners needed for designing secure solutions.

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  • MCUs from TI sense flow rate

    MCUs from TI sense flow rate

    Yup, there’s an MCU for just about everything. Case in point, the MSP430FR6xx family of ultrasonic sensing and measurement SoCs are optimized for water and heat meters.

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  • Littelfuse completes acquisition of IXYS Corporation

    The acquisition is a step forward in Littelfuse's strategy to accelerate growth within the power control and industrial OEM markets.

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  • VSORA closes Series A financing

    VSORA, an entrepreneurial startup set to deliver DSP IP for 5G wireless networks, has closed Series A financing.

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  • Achronix completes production silicon validation of 16nm FinFET+ Speedcore eFPGA technology

    Rigorous bench and ATE tests were completed across full operating conditions to verify the complete functionality of the Speedcore test chip.

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